EQSD-020-06.00-SEU-SBL-2-S

Application Technology丨A7805 Application field: Intelligent cockpit Unique advantages: Nationally produced solutions, main...[Details]

This week, MediaTek released the Dimensity 9000 chip, which not only snatched TSMC's first 4nm launch, but also, from the paper specifications, it is far better than the Snapdragon 888, and is very c...[Details]

Better system performance can be achieved by using a single high-power, isolated DC-DC module to convert the 48V voltage to an intermediate power supply, such as 12V or lower. This intermediate volta...[Details]

1. U/f constant control U/f control is to change the voltage of the motor power supply while changing the motor power supply frequency, so that the motor flux remains constant, and the motor e...[Details]

This example uses the STM32F103VET6 platform, which has three SPI interfaces (SPI1 is used here), and each signal line is connected to the CS, CLK, DO, and DIO lines of the FLASH (model: W25X16) to r...[Details]

The Naoi Laboratory of the Graduate School of Tokyo University of Agriculture and Technology has adopted the ultracentrifugal force field sol-gel method, which is one of the mechanochemical treatment ...[Details]

China Energy Storage Network: As the global energy system continues to innovate in the direction of green and low-carbon, emerging long-term energy storage technologies will become a key co...[Details]

China Energy Storage Network : China's power development has made great achievements in the past 40 years, effectively ensuring the country's power energy supply and meeting the power needs o...[Details]

On February 3, the topping-out ceremony of the test complex building of Sanan Optoelectronics Display Industrialization Project (Phase I) located in Gedian, Hubei Province was held. In July 2019, S...[Details]

With the evolution of electronic and electrical architecture, the automotive industry chain is developing in the direction of integration and centralization. As a relatively mature functional area of...[Details]

Intel announced that it has achieved mass production based on industry-leading semiconductor packaging solutions, including Intel's breakthrough 3D packaging technology Foveros, which provides flexib...[Details]

On the morning of December 7, at the Siam Oriental Industrial Park in Rayong, Thailand, with the announcement by Shan Xiangqian, Vice Governor of Anhui Province, the first battery product of Gotion...[Details]

Recently, the Shenzhen Regulatory Bureau disclosed CITIC Securities' summary report on the guidance work for Shenzhen Yuntian Lifei Technology Co., Ltd. (hereinafter referred to as Yuntian Lifei) for...[Details]

Microsoft's new product launch conference has just been held in the United States. At this conference, Microsoft welcomed several new partners, namely AMD, ARM and Qualcomm. It is not difficult to se...[Details]

Recently, the planned projects of Jiangsu Province's Carbon Peak and Carbon Neutrality Science and Technology Innovation Special Fund in 2024 were announced. A total of 14 projects are planned to b...[Details]