W9816G6JB-6 datasheet, PDF - EEWORLD Datasheet

W9816G6JB-6: Description512K X 2 BANKS X 16 BITS SDRAM; Categorystorage storage; File Size1MB，42 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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512K X 2 BANKS X 16 BITS SDRAM

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
package instruction	TFBGA,
Reach Compliance Code	compli
access mode	DUAL BANK PAGE BURST
Maximum access time	5 ns
Other features	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B60
length	10.1 mm
memory density	16777216 bi
Memory IC Type	SYNCHRONOUS DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	60
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum seat height	1.1 mm
self refresh	YES
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.65 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6.4 mm

	W9816G6JB-6	W9816G6JB	W9816G6JB-5	W9816G6JB-6I	W9816G6JB-7I	W9816G6JB-7
Description	512K X 2 BANKS X 16 BITS SDRAM	512K X 2 BANKS X 16 BITS SDRAM	512K X 2 BANKS X 16 BITS SDRAM	512K X 2 BANKS X 16 BITS SDRAM	512K X 2 BANKS X 16 BITS SDRAM	512K X 2 BANKS X 16 BITS SDRAM

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