Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Winbond Electronics Corporation |
package instruction | 6.40 X 10.10 MM, 0.65 MM PITCH, ROHS COMPLIANT, VFBGA-60 |
Reach Compliance Code | compli |
access mode | DUAL BANK PAGE BURST |
Maximum access time | 5 ns |
Other features | AUTO/SELF REFRESH |
JESD-30 code | R-PBGA-B60 |
length | 10.1 mm |
memory density | 16777216 bi |
Memory IC Type | SYNCHRONOUS DRAM |
memory width | 16 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 60 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 1MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Maximum seat height | 1.1 mm |
self refresh | YES |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.65 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 6.4 mm |