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Interview with Henri Ardevol, Executive Vice President of NXP If the automotive market and automotive technology undergo tremendous changes and innovations, then the future automotive electronic an...[Details]
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Modern electronic component assembly requires a more stable soldering temperature in the tin furnace, and the difficulty of high temperature control of the tin furnace is also increased. With the c...[Details]
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Intel recently announced the list of innovative teams for the third phase of the Intel AI Top 100 Innovation Incentive Program. After layers of screening and strict control, 16 outstanding innovation...[Details]
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Traditionally, computing tasks in cars are performed by microcontroller units ( MCUs ) and application processors (APs). A typical mid-range car can contain 25 to 35 MCUs/APs, while luxury cars may u...[Details]
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The author set out to write a working program for an IC card prepaid electricity meter. The meter uses Philips' 8-bit 51 extended single-chip microcomputer 87LPC764. It is required to realize many fun...[Details]
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1 Introduction
Integrated operational amplifiers are widely used in personal data assistants, communications, automotive electronics, audio products, instruments, sensors and other fields ...[Details]
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Beijing time, October 11, according to foreign media reports, the US Department of Defense hopes that the US military will be faster, stronger and more combat-capable in the future. Therefore, Amer...[Details]
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According to information on Renesas' official website, Renesas recently announced that the company has decided to withdraw from the LD (laser diode) and PD (photodiode) businesses. At the same time, ...[Details]
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The current module system of new energy vehicles is composed of many parts, such as batteries, VCU, BSM, motors, etc., but these are relatively mature products. Domestic and foreign module manufact...[Details]
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News on the morning of January 20th, ZTE Terminal held a media communication meeting recently. Ni Fei, senior vice president of ZTE Corporation and president of the Terminal Business Unit, Zha...[Details]
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This paper designs a building wireless video intercom circuit, which uses a single-chip microcomputer as the controller core and connects to peripheral circuits. It transmits video signals through ...[Details]
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element14 now selling Toshiba's latest intelligent gate drivers
Toshiba's innovative range of optocouplers for industrial and green energy applications now available for immediate pu...[Details]
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The 5G wave, artificial intelligence, and the Internet of Everything are accelerating the formation of a borderless smart life circle. With the huge number of personal privacy, cloud services, big da...[Details]
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Since the second half of 2019, the semiconductor industry has continued to grow in popularity, and the production capacity of major wafer fabs and packaging and testing plants has been tight. In the ...[Details]
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On October 30, GeoMate, a leading-edge mapping solutions provider, announced a partnership with dSPACE, a simulation and validation solutions provider, to accelerate the development of advanced dri...[Details]