MPC8272ZQM datasheet, PDF - EEWORLD Datasheet

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MPC8272ZQM: Description32-BIT, EPROM, 266MHz, RISC MICROCONTROLLER, PBGA516, 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-516; CategoryThe embedded processor and controller Microcontrollers and processors; File Size395KB，61 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MPC8272ZQM Overview

32-BIT, EPROM, 266MHz, RISC MICROCONTROLLER, PBGA516, 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-516

MPC8272ZQM Parametric

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	BGA
package instruction	BGA,
Contacts	516
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Has ADC	NO
Address bus width	30
bit size	32
maximum clock frequency	400 MHz
DAC channel	YES
DMA channel	YES
External data bus width	64
JESD-30 code	S-PBGA-B516
length	27 mm
Number of I/O lines	57
Number of terminals	516
Maximum operating temperature	70 °C
Minimum operating temperature
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
ROM programmability	EPROM
Maximum seat height	2.55 mm
speed	266 MHz
Maximum supply voltage	5.75 V
Minimum supply voltage	1.425 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	27 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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Freescale Semiconductor

Technical Data

Document Number: MPC8272EC

Rev. 3, 09/2011

MPC8272

PowerQUICC II Family

Hardware Specifications

This document contains detailed information about power

considerations, DC/AC electrical characteristics, and AC

timing specifications for .13µm (HiP7) members of the

PowerQUICC II family of integrated communications

processors—the MPC8272, the MPC8248, the MPC8271,

and the MPC8247. They include on a single chip a 32-bit

Power Architecture® core that incorporates memory

management units (MMUs) and instruction and data caches

and that implements the Power Architecture instruction set;

a modified communications processor module (CPM); and

an integrated security engine (SEC) for encryption (the

MPC8272 and the MPC8248 only).

All four devices are collectively referred to throughout this

hardware specification as “the MPC8272” unless otherwise

noted.

Contents

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . 7

DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . 9

Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . 14

Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

AC Electrical Characteristics . . . . . . . . . . . . . . . . . . 18

Clock Configuration Modes . . . . . . . . . . . . . . . . . . . 27

Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 56

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 58

Document Revision History . . . . . . . . . . . . . . . . . . . 58

10.

11.

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