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New Driver MM32F103 Test (I) Unboxing [Copy link]

This post was last edited by lising on 2018-10-27 23:04 I received the New Driving Force MM32F103 development board this afternoon. I would like to take this opportunity to express my gratitude to the Electronic Engineering World Forum for organizing this event and the New Driving Force company for providing the development board! The development board I received is very small and exquisite. The board is well made, the silk screen is very clear, and there are silk screens on both the front and back sides of the pin header, which is convenient for finding; the edges of the PCB are very smooth, and the four corners are also rounded, which feels very round when touched. The main control on the board uses the MM32F103C8T6 chip in the LQFP48 package, and all I/O pins have been brought out through the pin header. The board is equipped with a JATG debug port, a USB port, and a UART port, and has set RESET and WKUP buttons. The operating voltage can also be selected through a jumper cap. There is also a test port for testing power consumption and an LED. These components integrated on a PCB no bigger than a business card are enough to handle most development, applications, and learning. I took some pictures of the development board as a souvenir. (It was a little late to take the photo, so the light was not very good) 1. Front and back; 2. Different angles; 3. Main control chip MM32F103C8T6, crystal oscillator 8MHz, 32768KHz; 4. Serial port chip CH340T, crystal oscillator 12MHz; 5. LDO power chip AMS1117-3.3; 6. USB and UART interface; 7. RESET and WKUP buttons; 8. I happened to have a metal medicine box, so I gave the development board a home. It can prevent dust and static electricity when stored; In addition, the adjustable resistor R5 and pin header P3 on the board are not soldered, so the "ADC" experiment on the board cannot be done temporarily (internal temperature acquisition "ADC" experiment can be done); pin header P5 is also not soldered, which will affect the "WKUP" experiment. Prepare to re-solder.
 
 

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