Fast Page DRAM, 256KX16, 35ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP2-40
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Integrated Silicon Solution ( ISSI ) |
Parts packaging code | TSOP2 |
package instruction | 0.400 INCH, PLASTIC, TSOP2-40 |
Contacts | 40 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
access mode | FAST PAGE |
Maximum access time | 35 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O type | COMMON |
JESD-30 code | R-PDSO-G40 |
JESD-609 code | e0 |
length | 18.41 mm |
memory density | 4194304 bit |
Memory IC Type | FAST PAGE DRAM |
memory width | 16 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 40 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX16 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP2 |
Encapsulate equivalent code | TSOP40/44,.46,32 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 512 |
Maximum seat height | 1.2 mm |
self refresh | NO |
Maximum standby current | 0.001 A |
Maximum slew rate | 0.23 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.8 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 10.16 mm |