UVPROM, 16KX16, 30ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Cypress Semiconductor |
Parts packaging code | LCC |
package instruction | WINDOWED, CERAMIC, LCC-44 |
Contacts | 44 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 30 ns |
I/O type | COMMON |
JESD-30 code | S-CQCC-J44 |
JESD-609 code | e0 |
memory density | 262144 bit |
Memory IC Type | UVPROM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 44 |
word count | 16384 words |
character code | 16000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 16KX16 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC44,.7SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Maximum standby current | 0.25 A |
Maximum slew rate | 0.25 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |