F-213F213 (Rev 20AUG13)
CLP–115–02–L–D
CLP–107–02–F–D–P
TM
CLP–130–02–L–D
EXTENDED LIFE PRODUCT
(1,27 mm) .050"
CLP SERIES
CLP–116–02–F–DH
10 year Mixed Flowing Gas with 30µ" Gold
Call Samtec for maximum cycles
LOW PROFILE DUAL WIPE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?CLP
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Sn or Au over
50µ" (1,27 µm) Ni
Current Rating:
3.3 A per pin
(2 pins powered)
Operating Temp Range:
-55°C to +125°C
Contact Resistance:
10 mΩ
Insertion Depth:
Top Entry = (1,40 mm) .055"
minimum, Bottom Entry =
(2,41 mm) .095" minimum
plus board thickness
DH Entry = (2,31 mm) .091"
to (2,67 mm) .105"
Insertion Force:
(Single contact only)
3.8 oz (1,05 N) average
Normal Force:
60 grams (0,59 N) average
Withdrawal Force:
(Single contact only)
2 oz (0,56 N) average
Max Cycles:
100 with 10µ" (0,25 µm) Au
RoHS Compliant:
Yes
Mates with:
FTSH, FTS, FW
High reliability
Tiger Claw
™
contacts
(1,27 mm x 1,27 mm)
.050" x .050"
micro pitch
APPLICATIONS
CLP FTSH
Low Profile
(2,21 mm)
.087"
HORIZONTAL
Surface
Mount
PASS-THRU
Suitable for pass-through
applications
CLP
1
NO. PINS
PER ROW
02
PLATING
OPTION
ROW
OPTION
OTHER
OPTION
–F
02 thru 50
= Gold flash on
contact, Matte
Tin on tail
–D
= Double
Row
–BE
= Bottom Entry
(Required for bottom entry
applications)
Processing:
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (02-35)
(0,15 mm) .006" max (36-50)
–L
= 10µ" (0,25 µm)
Gold on contact,
Matte Tin on tail
No. of Positions
x (1,27) .050 + (0,43) .017
100
– DH
= Double
Horizontal
(Requires
FTSH –01
lead style)
–A
= Alignment Pin
(Not available with –PA option)
(05, 06, 07, 08, 10, 12, 15,
20, 25, 30, 40 positions only)
(–DH option and other sizes.
Call Samtec)
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
–G
= 10µ" (0,25 µm)
Gold
(–D only)
(4,32)
.170
02
(1,27)
.050
(0,41)
.016
–K
(6,35)
.250
x
(3,18)
.125
(2,44)
.096
ALSO AVAILABLE
(MOQ Required)
• Single row
• Other Platings
Contact Samtec.
(4,57) (3,05)
.180 .120
99
01
= (4,00 mm) .157" DIA
Polyimide film Pick & Place Pad
(5 positions min.)
(1,27)
.050
–P
= Pick & Place Pad
(5 positions min. –D only)
(Not always necessary
for auto placement.
See Flex Processing.)
–P OPTION
(3,43)
.135
(2,29)
.090
–DH
–D
(1,40)
.055
(8,25)
.325
(3,00)
.118
(0,89)
.035 DIA
(7,00)
.275
–PA OPTION
–PA
= Pick & Place Pad
with Alignment Pin
(–D only)
(Not Available with –A option)
A
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
PIN/ROW
A
(3,56) .140
04-15
(7,11) .280
16-50
If odd pins/row, alignment
pins are on middle position
on centerline of the part.
If even pins/row, then
alignment pins are between
middle two positions.
–TR
= Tape & Reel
WWW.SAMTEC.COM