70V7519S166DRG8 datasheet, PDF

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70V7519S166DRG8: DescriptionDual-Port SRAM, 256KX36, 3.6ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, QFP-208; Categorystorage storage; File Size750KB，22 Pages; ManufacturerIDT (Integrated Device Technology)

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70V7519S166DRG8 Overview

Dual-Port SRAM, 256KX36, 3.6ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, QFP-208

70V7519S166DRG8 Parametric

Parameter Name	Attribute value
Maker	IDT (Integrated Device Technology)
package instruction	QFP,
Reach Compliance Code	compliant
Maximum access time	3.6 ns
Other features	PIPELINED OR FLOW THROUGH ARCHITECTURE
JESD-30 code	S-PQFP-G208
memory density	9437184 bit
Memory IC Type	DUAL-PORT SRAM
memory width	36
Number of functions	1
Number of terminals	208
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX36
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Maximum supply voltage (Vsup)	3.45 V
Minimum supply voltage (Vsup)	3.15 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal location	QUAD

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HIGH-SPEED 3.3V 256K x 36

SYNCHRONOUS

BANK-SWITCHABLE

DUAL-PORT STATIC RAM

WITH 3.3V OR 2.5V INTERFACE

Features:

◆

IDT70V7519S

◆

256K x 36 Synchronous Bank-Switchable Dual-ported

SRAM Architecture

–

64 independent 4K x 36 banks

– 9 megabits of memory on chip

Bank access controlled via bank address pins

High-speed data access

– Commercial: 3.4ns(200MHz)/3.6ns (166MHz)/4.2ns

(133MHz) (max.)

– Industrial: 3.6ns (166MHz)/4.2ns (133MHz) (max.)

Selectable Pipelined or Flow-Through output mode

Counter enable and repeat features

Dual chip enables allow for depth expansion without

additional logic

Full synchronous operation on both ports

– 5ns cycle time, 200MHz operation (14Gbps bandwidth)

– Fast 3.4ns clock to data out

◆

– 1.5ns setup to clock and 0.5ns hold on all control, data, and

address inputs @ 200MHz

– Data input, address, byte enable and control registers

– Self-timed write allows fast cycle time

Separate byte controls for multiplexed bus and bus

matching compatibility

LVTTL- compatible, 3.3V (±150mV) power supply

for core

LVTTL compatible, selectable 3.3V (±150mV) or 2.5V (±100mV)

power supply for I/Os and control signals on each port

Industrial temperature range (-40°C to +85°C) is

available at 166MHz and 133MHz

Available in a 208-pin Plastic Quad Flatpack (PQFP),

208-pin fine pitch Ball Grid Array (fpBGA), and 256-pin Ball

Grid Array (BGA)

Supports JTAG features compliant with IEEE 1149.1

Green parts available, see ordering information

Functional Block Diagram

PL/FT

OPT

CLK

ADS

CNTEN

REPEAT

R/W

PL/FT

OPT

CLK

ADS

CNTEN

REPEAT

R/W

CONTROL

LOGIC

MUX

4Kx36

MEMORY

ARRAY

(BANK 0)

MUX

CONTROL

LOGIC

I/O

0L-35L

I/O

CONTROL

MUX

4Kx36

MEMORY

ARRAY

(BANK 1)

MUX

I/O

CONTROL

I/O

0R-35R

11L

ADDRESS

DECODE

ADDRESS

DECODE

11R

BANK

DECODE

MUX

4Kx36

MEMORY

ARRAY

(BANK 63)

BANK

DECODE

NOTE:

1. The Bank-Switchable dual-port uses a true SRAM

core instead of the traditional dual-port SRAM core.

As a result, it has unique operating characteristics.

Please refer to the functional description on page 19

for details.

MUX

TDI

TDO

JTAG

TMS

TCK

TRST

5618 drw 01

JUNE 2015

DSC 5618/9

70V7519S166DRG8 Related Products

	70V7519S166DRG8	70V7519S166BCG8	70V7519S166BCGI8	70V7519S166BCGI	70V7519S166DRGI	70V7519S166DRGI8	70V7519S133BFG	70V7519S133BFG8
Description	Dual-Port SRAM, 256KX36, 3.6ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, QFP-208	Dual-Port SRAM, 256KX36, 3.6ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256	Dual-Port SRAM, 256KX36, 3.6ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256	Dual-Port SRAM, 256KX36, 3.6ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256	Dual-Port SRAM, 256KX36, 3.6ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, QFP-208	Dual-Port SRAM, 256KX36, 3.6ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, QFP-208	Dual-Port SRAM, 256KX36, 4.2ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208	Dual-Port SRAM, 256KX36, 4.2ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208
package instruction	QFP,	BGA,	BGA,	BGA,	QFP,	QFP,	BGA,	BGA,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
Maximum access time	3.6 ns	3.6 ns	3.6 ns	3.6 ns	3.6 ns	3.6 ns	4.2 ns	4.2 ns
Other features	PIPELINED OR FLOW THROUGH ARCHITECTURE	PIPELINED OR FLOW THROUGH ARCHITECTURE	PIPELINED OR FLOW THROUGH ARCHITECTURE	PIPELINED OR FLOW THROUGH ARCHITECTURE	PIPELINED OR FLOW THROUGH ARCHITECTURE	PIPELINED OR FLOW THROUGH ARCHITECTURE	PIPELINED OR FLOW THROUGH ARCHITECTURE	PIPELINED OR FLOW THROUGH ARCHITECTURE
JESD-30 code	S-PQFP-G208	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PQFP-G208	S-PQFP-G208	S-PBGA-B208	S-PBGA-B208
memory density	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM
memory width	36	36	36	36	36	36	36	36
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	208	256	256	256	208	208	208	208
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000	256000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	85 °C	85 °C	85 °C	85 °C	70 °C	70 °C
organize	256KX36	256KX36	256KX36	256KX36	256KX36	256KX36	256KX36	256KX36
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	BGA	BGA	BGA	QFP	QFP	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	GRID ARRAY	GRID ARRAY	GRID ARRAY	FLATPACK	FLATPACK	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Maximum supply voltage (Vsup)	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V
Minimum supply voltage (Vsup)	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	BALL	BALL	BALL	GULL WING	GULL WING	BALL	BALL
Terminal location	QUAD	BOTTOM	BOTTOM	BOTTOM	QUAD	QUAD	BOTTOM	BOTTOM
Maker	IDT (Integrated Device Technology)	-	-	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)

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