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IS61WV25616BLL-10TLI-TR

Description
Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44
Categorystorage    storage   
File Size207KB,21 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance  
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IS61WV25616BLL-10TLI-TR Overview

Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44

IS61WV25616BLL-10TLI-TR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeTSOP2
package instructionTSOP2, TSOP44,.46,32
Contacts44
Reach Compliance Codecompli
ECCN code3A991.B.2.A
Factory Lead Time8 weeks
Maximum access time10 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G44
JESD-609 codee3
length18.41 mm
memory density4194304 bi
Memory IC TypeSTANDARD SRAM
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals44
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP44,.46,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply2.5/3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.009 A
Minimum standby current2 V
Maximum slew rate0.045 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.4 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width10.16 mm
Base Number Matches1

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Description Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44 Standard SRAM, 256KX16, 10ns, CMOS, PBGA48, 6 X 8 MM, LEAD FREE, MINI, BGA-48 Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44 Standard SRAM, 256KX16, 10ns, CMOS, PDSO44 Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44 Standard SRAM, 256KX16, 10ns, CMOS, PBGA48 Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Reach Compliance Code compli compli compli compliant compliant compliant compliant
Factory Lead Time 8 weeks 8 weeks 8 weeks 12 weeks 8 weeks 8 weeks 8 weeks
Maximum access time 10 ns 10 ns 10 ns 10 ns 10 ns 10 ns 10 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-G44 R-PBGA-B48 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PBGA-B48 R-PDSO-G44
memory density 4194304 bi 4194304 bi 4194304 bi 4194304 bit 4194304 bit 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 16 16 16 16 16 16 16
Number of terminals 44 48 44 44 44 48 44
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 125 °C 70 °C 85 °C 70 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C - -40 °C -
organize 256KX16 256KX16 256KX16 256KX16 256KX16 256KX16 256KX16
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 TFBGA TSOP2 TSOP TSOP2 FBGA TSOP2
Encapsulate equivalent code TSOP44,.46,32 BGA48,6X8,30 TSOP44,.46,32 TSOP44,.46,32 TSOP44,.46,32 BGA48,6X8,30 TSOP44,.46,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.009 A 0.009 A 0.009 A 0.015 A 0.008 A 0.009 A 0.008 A
Minimum standby current 2 V 2 V 2 V 2 V 2 V 2 V 2 V
Maximum slew rate 0.045 mA 0.045 mA 0.045 mA 0.065 mA 0.04 mA 0.045 mA 0.04 mA
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL AUTOMOTIVE COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal form GULL WING BALL GULL WING GULL WING GULL WING BALL GULL WING
Terminal pitch 0.8 mm 0.75 mm 0.8 mm 0.8 mm 0.8 mm 0.75 mm 0.8 mm
Terminal location DUAL BOTTOM DUAL DUAL DUAL BOTTOM DUAL
Base Number Matches 1 1 1 1 1 1 1
Is it lead-free? Lead free Lead free Lead free - Lead free - Lead free
Parts packaging code TSOP2 BGA TSOP2 - TSOP2 - TSOP2
package instruction TSOP2, TSOP44,.46,32 TFBGA, BGA48,6X8,30 TSOP2, TSOP44,.46,32 TSOP, TSOP44,.46,32 TSOP2, TSOP44,.46,32 - TSOP2, TSOP44,.46,32
Contacts 44 48 44 - 44 - 44
ECCN code 3A991.B.2.A 3A991 3A991.B.2.A - 3A991.B.2.A - 3A991.B.2.A
JESD-609 code e3 e1 e3 - e3 - e3
length 18.41 mm 8 mm 18.415 mm - 18.41 mm - 18.415 mm
Humidity sensitivity level 3 3 3 - 3 - 3
Number of functions 1 1 1 - 1 - 1
Peak Reflow Temperature (Celsius) 260 260 260 - 260 - 260
Maximum seat height 1.2 mm 1.2 mm 1.2 mm - 1.2 mm - 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V - 3.6 V - 3.6 V
Minimum supply voltage (Vsup) 2.4 V 2.4 V 2.4 V - 2.4 V - 2.4 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V - 3.3 V - 3.3 V
Terminal surface MATTE TIN Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) - annealed - MATTE TIN - Matte Tin (Sn) - annealed
Maximum time at peak reflow temperature 40 40 40 - 40 - 40
width 10.16 mm 6 mm 10.16 mm - 10.16 mm - 10.16 mm
Maker - - - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )

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