Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | TSOP2 |
package instruction | TSOP2, TSOP44,.46,32 |
Contacts | 44 |
Reach Compliance Code | compli |
ECCN code | 3A991.B.2.A |
Factory Lead Time | 8 weeks |
Maximum access time | 10 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-G44 |
JESD-609 code | e3 |
length | 18.41 mm |
memory density | 4194304 bi |
Memory IC Type | STANDARD SRAM |
memory width | 16 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 44 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 256KX16 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP2 |
Encapsulate equivalent code | TSOP44,.46,32 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 2.5/3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum standby current | 0.009 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.045 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.4 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 0.8 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
width | 10.16 mm |
Base Number Matches | 1 |
IS61WV25616BLL-10TLI-TR | IS61WV25616BLL-10BLI | IS61WV25616BLL-10TLI | IS64WV25616BLL-10CTLA3-TR | IS61WV25616BLL-10TL-TR | IS61WV25616BLL-10BLI-TR | IS61WV25616BLL-10TL | |
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Description | Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44 | Standard SRAM, 256KX16, 10ns, CMOS, PBGA48, 6 X 8 MM, LEAD FREE, MINI, BGA-48 | Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 256KX16, 10ns, CMOS, PDSO44 | Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44 | Standard SRAM, 256KX16, 10ns, CMOS, PBGA48 | Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44 |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
Reach Compliance Code | compli | compli | compli | compliant | compliant | compliant | compliant |
Factory Lead Time | 8 weeks | 8 weeks | 8 weeks | 12 weeks | 8 weeks | 8 weeks | 8 weeks |
Maximum access time | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PDSO-G44 | R-PBGA-B48 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PBGA-B48 | R-PDSO-G44 |
memory density | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Number of terminals | 44 | 48 | 44 | 44 | 44 | 48 | 44 |
word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 125 °C | 70 °C | 85 °C | 70 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | - |
organize | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TSOP2 | TFBGA | TSOP2 | TSOP | TSOP2 | FBGA | TSOP2 |
Encapsulate equivalent code | TSOP44,.46,32 | BGA48,6X8,30 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | BGA48,6X8,30 | TSOP44,.46,32 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, FINE PITCH | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 0.009 A | 0.009 A | 0.009 A | 0.015 A | 0.008 A | 0.009 A | 0.008 A |
Minimum standby current | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
Maximum slew rate | 0.045 mA | 0.045 mA | 0.045 mA | 0.065 mA | 0.04 mA | 0.045 mA | 0.04 mA |
surface mount | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
Terminal form | GULL WING | BALL | GULL WING | GULL WING | GULL WING | BALL | GULL WING |
Terminal pitch | 0.8 mm | 0.75 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.75 mm | 0.8 mm |
Terminal location | DUAL | BOTTOM | DUAL | DUAL | DUAL | BOTTOM | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Is it lead-free? | Lead free | Lead free | Lead free | - | Lead free | - | Lead free |
Parts packaging code | TSOP2 | BGA | TSOP2 | - | TSOP2 | - | TSOP2 |
package instruction | TSOP2, TSOP44,.46,32 | TFBGA, BGA48,6X8,30 | TSOP2, TSOP44,.46,32 | TSOP, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | - | TSOP2, TSOP44,.46,32 |
Contacts | 44 | 48 | 44 | - | 44 | - | 44 |
ECCN code | 3A991.B.2.A | 3A991 | 3A991.B.2.A | - | 3A991.B.2.A | - | 3A991.B.2.A |
JESD-609 code | e3 | e1 | e3 | - | e3 | - | e3 |
length | 18.41 mm | 8 mm | 18.415 mm | - | 18.41 mm | - | 18.415 mm |
Humidity sensitivity level | 3 | 3 | 3 | - | 3 | - | 3 |
Number of functions | 1 | 1 | 1 | - | 1 | - | 1 |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | - | 260 | - | 260 |
Maximum seat height | 1.2 mm | 1.2 mm | 1.2 mm | - | 1.2 mm | - | 1.2 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | - | 3.6 V |
Minimum supply voltage (Vsup) | 2.4 V | 2.4 V | 2.4 V | - | 2.4 V | - | 2.4 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | - | 3.3 V |
Terminal surface | MATTE TIN | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) - annealed | - | MATTE TIN | - | Matte Tin (Sn) - annealed |
Maximum time at peak reflow temperature | 40 | 40 | 40 | - | 40 | - | 40 |
width | 10.16 mm | 6 mm | 10.16 mm | - | 10.16 mm | - | 10.16 mm |
Maker | - | - | - | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |