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IS61WV25616BLL-10BLI-TR

Description
Standard SRAM, 256KX16, 10ns, CMOS, PBGA48
Categorystorage   
File Size207KB,21 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance
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IS61WV25616BLL-10BLI-TR Overview

Standard SRAM, 256KX16, 10ns, CMOS, PBGA48

IS61WV25616BLL-10BLI-TR Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerIntegrated Silicon Solution ( ISSI )
Reach Compliance Codecompliant
Factory Lead Time8 weeks
Is SamacsysN
Maximum access time10 ns
I/O typeCOMMON
JESD-30 codeR-PBGA-B48
memory density4194304 bit
Memory IC TypeSTANDARD SRAM
memory width16
Number of terminals48
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA48,6X8,30
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
Parallel/SerialPARALLEL
power supply2.5/3.3 V
Certification statusNot Qualified
Maximum standby current0.009 A
Minimum standby current2 V
Maximum slew rate0.045 mA
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
Base Number Matches1

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Description Standard SRAM, 256KX16, 10ns, CMOS, PBGA48 Standard SRAM, 256KX16, 10ns, CMOS, PBGA48, 6 X 8 MM, LEAD FREE, MINI, BGA-48 Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44 Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44 Standard SRAM, 256KX16, 10ns, CMOS, PDSO44 Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44 Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Reach Compliance Code compliant compli compli compli compliant compliant compliant
Factory Lead Time 8 weeks 8 weeks 8 weeks 8 weeks 12 weeks 8 weeks 8 weeks
Maximum access time 10 ns 10 ns 10 ns 10 ns 10 ns 10 ns 10 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PBGA-B48 R-PBGA-B48 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44
memory density 4194304 bit 4194304 bi 4194304 bi 4194304 bi 4194304 bit 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 16 16 16 16 16 16 16
Number of terminals 48 48 44 44 44 44 44
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 125 °C 70 °C 70 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C - -
organize 256KX16 256KX16 256KX16 256KX16 256KX16 256KX16 256KX16
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA TFBGA TSOP2 TSOP2 TSOP TSOP2 TSOP2
Encapsulate equivalent code BGA48,6X8,30 BGA48,6X8,30 TSOP44,.46,32 TSOP44,.46,32 TSOP44,.46,32 TSOP44,.46,32 TSOP44,.46,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.009 A 0.009 A 0.009 A 0.009 A 0.015 A 0.008 A 0.008 A
Minimum standby current 2 V 2 V 2 V 2 V 2 V 2 V 2 V
Maximum slew rate 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.065 mA 0.04 mA 0.04 mA
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL AUTOMOTIVE COMMERCIAL COMMERCIAL
Terminal form BALL BALL GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.75 mm 0.75 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM DUAL DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1 1 1 1
Maker Integrated Silicon Solution ( ISSI ) - - - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Is it lead-free? - Lead free Lead free Lead free - Lead free Lead free
Parts packaging code - BGA TSOP2 TSOP2 - TSOP2 TSOP2
package instruction - TFBGA, BGA48,6X8,30 TSOP2, TSOP44,.46,32 TSOP2, TSOP44,.46,32 TSOP, TSOP44,.46,32 TSOP2, TSOP44,.46,32 TSOP2, TSOP44,.46,32
Contacts - 48 44 44 - 44 44
ECCN code - 3A991 3A991.B.2.A 3A991.B.2.A - 3A991.B.2.A 3A991.B.2.A
JESD-609 code - e1 e3 e3 - e3 e3
length - 8 mm 18.41 mm 18.415 mm - 18.41 mm 18.415 mm
Humidity sensitivity level - 3 3 3 - 3 3
Number of functions - 1 1 1 - 1 1
Peak Reflow Temperature (Celsius) - 260 260 260 - 260 260
Maximum seat height - 1.2 mm 1.2 mm 1.2 mm - 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) - 3.6 V 3.6 V 3.6 V - 3.6 V 3.6 V
Minimum supply voltage (Vsup) - 2.4 V 2.4 V 2.4 V - 2.4 V 2.4 V
Nominal supply voltage (Vsup) - 3.3 V 3.3 V 3.3 V - 3.3 V 3.3 V
Terminal surface - Tin/Silver/Copper (Sn/Ag/Cu) MATTE TIN Matte Tin (Sn) - annealed - MATTE TIN Matte Tin (Sn) - annealed
Maximum time at peak reflow temperature - 40 40 40 - 40 40
width - 6 mm 10.16 mm 10.16 mm - 10.16 mm 10.16 mm

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