IS61WV25616BLL-10TL datasheet, PDF

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IS61WV25616BLL-10TL: DescriptionStandard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44; Categorystorage; File Size207KB，21 Pages; ManufacturerIntegrated Silicon Solution ( ISSI ); Environmental Compliance

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IS61WV25616BLL-10TL Overview

Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44

IS61WV25616BLL-10TL Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	TSOP2
package instruction	TSOP2, TSOP44,.46,32
Contacts	44
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Factory Lead Time	8 weeks
Is Samacsys	N
Maximum access time	10 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G44
JESD-609 code	e3
length	18.415 mm
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	44
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Encapsulate equivalent code	TSOP44,.46,32
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	2.5/3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.008 A
Minimum standby current	2 V
Maximum slew rate	0.04 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.4 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn) - annealed
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	10.16 mm
Base Number Matches	1

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Description	Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 256KX16, 10ns, CMOS, PBGA48, 6 X 8 MM, LEAD FREE, MINI, BGA-48	Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44	Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 256KX16, 10ns, CMOS, PDSO44	Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44	Standard SRAM, 256KX16, 10ns, CMOS, PBGA48
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Reach Compliance Code	compliant	compli	compli	compli	compliant	compliant	compliant
Factory Lead Time	8 weeks	8 weeks	8 weeks	8 weeks	12 weeks	8 weeks	8 weeks
Maximum access time	10 ns	10 ns	10 ns	10 ns	10 ns	10 ns	10 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDSO-G44	R-PBGA-B48	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PBGA-B48
memory density	4194304 bit	4194304 bi	4194304 bi	4194304 bi	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	16	16	16	16	16	16
Number of terminals	44	48	44	44	44	44	48
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	85 °C	85 °C	125 °C	70 °C	85 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C
organize	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	TFBGA	TSOP2	TSOP2	TSOP	TSOP2	FBGA
Encapsulate equivalent code	TSOP44,.46,32	BGA48,6X8,30	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32	BGA48,6X8,30
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.008 A	0.009 A	0.009 A	0.009 A	0.015 A	0.008 A	0.009 A
Minimum standby current	2 V	2 V	2 V	2 V	2 V	2 V	2 V
Maximum slew rate	0.04 mA	0.045 mA	0.045 mA	0.045 mA	0.065 mA	0.04 mA	0.045 mA
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	COMMERCIAL	INDUSTRIAL
Terminal form	GULL WING	BALL	GULL WING	GULL WING	GULL WING	GULL WING	BALL
Terminal pitch	0.8 mm	0.75 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.75 mm
Terminal location	DUAL	BOTTOM	DUAL	DUAL	DUAL	DUAL	BOTTOM
Base Number Matches	1	1	1	1	1	1	1
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	-	Lead free	-
Maker	Integrated Silicon Solution ( ISSI )	-	-	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	TSOP2	BGA	TSOP2	TSOP2	-	TSOP2	-
package instruction	TSOP2, TSOP44,.46,32	TFBGA, BGA48,6X8,30	TSOP2, TSOP44,.46,32	TSOP2, TSOP44,.46,32	TSOP, TSOP44,.46,32	TSOP2, TSOP44,.46,32	-
Contacts	44	48	44	44	-	44	-
ECCN code	3A991.B.2.A	3A991	3A991.B.2.A	3A991.B.2.A	-	3A991.B.2.A	-
JESD-609 code	e3	e1	e3	e3	-	e3	-
length	18.415 mm	8 mm	18.41 mm	18.415 mm	-	18.41 mm	-
Humidity sensitivity level	3	3	3	3	-	3	-
Number of functions	1	1	1	1	-	1	-
Peak Reflow Temperature (Celsius)	260	260	260	260	-	260	-
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	-	1.2 mm	-
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V	-
Minimum supply voltage (Vsup)	2.4 V	2.4 V	2.4 V	2.4 V	-	2.4 V	-
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V	-
Terminal surface	Matte Tin (Sn) - annealed	Tin/Silver/Copper (Sn/Ag/Cu)	MATTE TIN	Matte Tin (Sn) - annealed	-	MATTE TIN	-
Maximum time at peak reflow temperature	40	40	40	40	-	40	-
width	10.16 mm	6 mm	10.16 mm	10.16 mm	-	10.16 mm	-

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