Single Channel, 50 to 200ksps, 8-Bit A/D Converter
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| package instruction | LLP-6 |
| Reach Compliance Code | _compli |
| ECCN code | EAR99 |
| Maximum analog input voltage | 5.25 V |
| Minimum analog input voltage | |
| Maximum conversion time | 16 µs |
| Converter type | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 code | R-PDSO-N6 |
| JESD-609 code | e0 |
| length | 2.5 mm |
| Maximum linear error (EL) | 0.1172% |
| Humidity sensitivity level | 1 |
| Number of analog input channels | 1 |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 6 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output bit code | BINARY |
| Output format | SERIAL |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVSON |
| Encapsulate equivalent code | SOLCC6,.1,25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| Sampling rate | 0.2 MHz |
| Sample and hold/Track and hold | TRACK |
| Maximum seat height | 0.8 mm |
| Nominal supply voltage | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| width | 2.2 mm |
| ADC081S021CISD | ADC081S021 | ADC081S021CIMF | ADC081S021CIMFX | |
|---|---|---|---|---|
| Description | Single Channel, 50 to 200ksps, 8-Bit A/D Converter | Single Channel, 50 to 200ksps, 8-Bit A/D Converter | Single Channel, 50 to 200ksps, 8-Bit A/D Converter | Single Channel, 50 to 200ksps, 8-Bit A/D Converter |
| Is it Rohs certified? | incompatible | - | incompatible | incompatible |
| Maker | National Semiconductor（TI ） | - | National Semiconductor（TI ） | National Semiconductor（TI ） |
| package instruction | LLP-6 | - | SOT-23, 6 PIN | SOT-23, 6 PIN |
| Reach Compliance Code | _compli | - | _compli | _compli |
| ECCN code | EAR99 | - | EAR99 | EAR99 |
| Maximum analog input voltage | 5.25 V | - | 5.25 V | 5.25 V |
| Maximum conversion time | 16 µs | - | 16 µs | 16 µs |
| Converter type | ADC, SUCCESSIVE APPROXIMATION | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 code | R-PDSO-N6 | - | R-PDSO-G6 | R-PDSO-G6 |
| JESD-609 code | e0 | - | e0 | e0 |
| length | 2.5 mm | - | 2.92 mm | 2.92 mm |
| Maximum linear error (EL) | 0.1172% | - | 0.1172% | 0.1172% |
| Humidity sensitivity level | 1 | - | 1 | 1 |
| Number of analog input channels | 1 | - | 1 | 1 |
| Number of digits | 8 | - | 8 | 8 |
| Number of functions | 1 | - | 1 | 1 |
| Number of terminals | 6 | - | 6 | 6 |
| Maximum operating temperature | 85 °C | - | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | - | -40 °C | -40 °C |
| Output bit code | BINARY | - | BINARY | BINARY |
| Output format | SERIAL | - | SERIAL | SERIAL |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | HVSON | - | LSSOP | LSSOP |
| Encapsulate equivalent code | SOLCC6,.1,25 | - | TSOP6,.11,37 | TSOP6,.11,37 |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 | - | 260 | 260 |
| power supply | 3/5 V | - | 3/5 V | 3/5 V |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified |
| Sampling rate | 0.2 MHz | - | 0.2 MHz | 0.2 MHz |
| Sample and hold/Track and hold | TRACK | - | TRACK | TRACK |
| Maximum seat height | 0.8 mm | - | 1.22 mm | 1.22 mm |
| Nominal supply voltage | 3 V | - | 3 V | 3 V |
| surface mount | YES | - | YES | YES |
| technology | CMOS | - | CMOS | CMOS |
| Temperature level | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | - | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | - | 0.95 mm | 0.95 mm |
| Terminal location | DUAL | - | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | - | 40 | 40 |
| width | 2.2 mm | - | 1.6 mm | 1.6 mm |
| Part Number | Manufacturer | Description |
|---|---|---|
| ADC081S021CISD/NOPB | Texas Instruments(德州仪器) | Single Channel, 50 to 200 ksps, 8-Bit A/D Converter 6-WSON -40 to 85 |
| ADC081S021CISDX | National Semiconductor（TI ） | IC 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO6, LLP-6, Analog to Digital Converter |
| ADC081S021CISD | Texas Instruments(德州仪器) | Analog to Digital Converters - ADC Single Channel, 50 to 200 ksps, 8-Bit A/D Converter 6-WSON -40 to 85 |
| ADC081S021CISDX/NOPB | Texas Instruments(德州仪器) | Analog to Digital Converters - ADC SGL CH 50-200kSPS 8B ADC |
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