BZX784B30 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> BZX784B30

Preview

BZX784B30: DescriptionZener diode; CategoryDiscrete semiconductor; File Size1MB，2 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

BZX784B30 Overview

Zener diode

Features

Product Name: Zener Diode

Product model: BZX784B30

product features:

Planar Die Construction

100mW Power Dissipation

Zener Voltages from 2.4 – 39V

Product parameters:

Pd power dissipation: 100mW

Vz stable voltage: Nom=30V Min=29.4V Max=30.6V

Zzt breakdown impedance: 80Ω

Zzk breakdown impedance: 300Ω

IR reverse current: 0.1uA

Vf forward voltage drop: 0.9V

Package: SOD-723

BZX784B30 Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOD-723 Plastic-Encapsulate Diode

BZX784B2V4-BZX784B39

ZENER DIODE

FEATURES

• Planar Die Construction

•

100mW Power Dissipation

•

Zener Voltages from 2.4 – 39V

SOD-723

Maximum Ratings(T

=25℃ unless otherwise specified)

Characteristic

Forward Voltage

Power Dissipation

Thermal Resistance, Junction to Ambient Air

Operating and Storage Temperature Range

=10mA

Symbol

STG

Value

0.9

100

1250

-65~ +150

Unit

℃

A,Jun,2011

Recommended Resources

Zero-crossing trigger circuit design based on thyristor

Infrared remote control receiving circuit using PH302

Delayed lights-out pull switch circuit (1)

Z35 type radial drilling machine electrical schematic circuit

Triac light dimmer

MCl306P audio power amplifier circuit

【BearPi-HM Micro】Part 2: Building an OpenHarmony compilation environment from scratch: [i=s]This post was last edited by Digital Leaf on 2022-3-26 15:36[/i]For the compilation environment of OpenHarmony, you can choose a simple way, which is to directly use the system image provided by ...; 数码小叶 Linux and Android

Programmable limiter or selector, programmable frequency selector if there is an integrated chip: If there is an integrated chip for programmable limiters or selectors, programmable frequency selectorsWe know that there are filters, frequency selectors, and limiters. Is there an amplitude selector...; QWE4562009 Discrete Device

October 20th Live Review: Flyback Isolated Power Supply Design without Optocoupler (Video, Presentation Document, Q&A): Live broadcast time: October 20, 10:00-11:30Live broadcast topic: Flyback isolated power supply design without optocouplerPresentation document: Click here to downloadWatch replay: Click to watchQA su...; dancerzj Power technology

MSP430 development tools and their features: At present, the company's MSP430 development tools mainly include emulators, programmers, various learning boards, transfer boards, adapters, etc.1. Emulator, programmerIAR and JTAG cannot connect, wh...; Aguilera Microcontroller MCU

Linux network card promiscuous mode and monitoring mode: [size=4]Promiscuous mode is a term in computer networks. It means that a machine's network card can receive all data streams passing through it, regardless of whether the destination address is it. [/...; 灞波儿奔 RF/Wirelessly

When voting for National Chip brands, Rockchip received a lot of votes. What is the demand for this company in the forum?: At the beginning of the year, I did a small-scale activity in the forum: Vote for reliable national chips - MCU: Test, test, test, which reliable national chips have the first-line forum friends detec...; nmg Domestic Chip Exchange

Popular Components