MVAS-068-ZHGG-10 datasheet, PDF

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MVAS-068-ZHGG-10: DescriptionIC Socket, PGA68, 68 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder, ROHS COMPLIANT; CategoryThe connector socket; File Size490KB，2 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/; Environmental Compliance

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MVAS-068-ZHGG-10 Overview

IC Socket, PGA68, 68 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder, ROHS COMPLIANT

MVAS-068-ZHGG-10 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SAMTEC
package instruction	ROHS COMPLIANT
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	LOW PROFILE
body width	1 inch
subject depth	0.553 inch
body length	1 inch
Contact structure	10X10
Contact to complete cooperation	GOLD (30) OVER NICKEL
Contact completed and terminated	Gold (Au) - with Nickel (Ni) barrier
Contact material	BERYLLIUM COPPER
Contact style	RND PIN-SKT
current rating	1 A
Device slot type	IC SOCKET
Type of equipment used	PGA68
Dielectric withstand voltage	1000VAC V
Shell material	GLASS FILLED POLYESTER
Insulation resistance	5000000000 Ω
JESD-609 code	e4
Plug contact pitch	0.1 inch
Installation method	STRAIGHT
Number of contacts	68
Maximum operating temperature	125 °C
Minimum operating temperature	-65 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	0.1 mm
Terminal pitch	2.54 mm
Termination type	SOLDER

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F-208 SUPPLEMENT

MPAS–144–ZSGT–13

MPAS–068–ZSGT–11

PIN GRID ARRAY SOCKETS

Mates with:

MPAT, MVAT, MHAT, MSAT

MPAS, MVAS,

MSAS SERIES

PIN OUT

CODE

SPECIFICATIONS

For complete speciﬁcations

see www.samtec.com?MPAS

or www.samtec.com?MVAS

BODY

STYLE

COUNT

LEAD

STYLE

PLATING

OPTION

MPAS

= Standard

Polyester

MVAS

= Open

Body Polyester

–“XXX”

= Total Number

of Filled

Positions

= 30µ" (0,76µm)

Gold Contact,

10µ" (0,25µm)

Gold Shell

–2

= (9,14).360

Wire-Wrap

(–ZW Only)

MPAS, MVAS

Insulator Material:

Black G.F. Polyester

Contact:

BeCu

Shell:

Brass except Style K

Phospher Bronze

Operating Temp Range:

-55°C to +105°C with Tin

-55°C to +125°C with Gold

Plating:

Au over 50µ"(1,27µm) Ni or

Sn over 100µ" (2,58µm) Cu or

50µ" (1,27µm) Ni

Current Rating:

Contact Resistance:

10mΩ max

Lead Size Range:

.015" (0,38mm) to

.022" (0,56mm) DIA except

Style ZL = .015" (0,38mm) to

.020" (0,51mm) DIA

Insertion Force:

(Single contact only) Style ZU

= 1.5oz (0,42N) max, all others

= 2.5 oz (0,69N) avg, 5.5 oz

(1,53N) max, except Styles J

& K = 9 oz (2,50N) avg, 16 oz

(4,45N) max

Withdrawal Force:

(Single contact only) Style ZU

= 1.5oz (0,42N) max, all others

= 2.0 oz (0,56N) avg, 0.35 oz

(0,97N) min, except Styles J &

K = 2.5 oz (0,69N) avg, 1.5 oz

(0,42N) min

Lead-Free Solderable:

Wave, only

RoHS Compliant:

Note:

Some sizes, styles and

options are non-standard,

non-returnable.

MSAS

= Hi-Temp LCP

Open Body

No. of Positions X .100 (2,54) SQ

ALSO AVAILABLE

= 30µ" (0,76µm)

Gold Contact,

Tin Shell

–3

= (6,60).260

Wire-Wrap

(–ZW Only)

(2,54)

.100

RoHS compliant

options.

Call Samtec.

–L

= Locking

Socket

(–ZS Only)

fre

w.sam

tec.com/lead-

= Tin Contact

and Shell

(Styles –ZS &

ZW Only)

= 10µ" (5,08µm)

Gold Contact,

Tin Shell

(Style –ZS only)

(7,62)

.300

(3,43)

.135

Requires GT

Plating Option

–ZW

= Wire-Wrap

(0,76)

.030

(1,32)

(4,90) .052

.193 DIA

(0,76)

.030

Shorter w/w

tail lengths

available.

See OPTION.

(12,95)

.510

(0,89)

.035

DIA

Insertion Depth = .125" to .157"

Style ZW Component Part No. = EZ-1W1(1)

Style ZW-2 Component Part No. = EZ-1W1(2)

Style ZW-3 Component Part No. = EZ-1W1(3)

(1,32)

.052

DIA

–ZE or –ZH

= Elevated

LEAD

STYLE

DIA

(0,51)

.020

(0,46)

.018

TAIL

(4,32)

.170

(3,81)

.150

OAL

–ZE

–ZH

(8,86) (13,77)

.349

.542

(12,95) (17,86)

.510

.703

SPECIFICATIONS

For complete speciﬁcations

see www.samtec.com?MSAS

Insertion Depth = .125" to .170"

Style ZE Component Part No. = EZ-2P3

Insertion Depth = .125" to .145"

Style ZH Component Part No. = EZ-2P2

MSAS

(0,64)

.025

Same as

MPAS except:

Insulator Material:

Black Liquid Crystal Polymer

Max Processing Temp:

230°C for 30 to 60 seconds

–ZS, –ZU, –ZA, –J, –K

(0,76)

.030

Locking lead (–L) available.

See OPTION.

LEAD

STYLE

= Printed Circuit

–ZL

= Low Proﬁle

(0,76)

.030

(1,32)

.052

DIA

(0,76)

.030

DIA

(3,10)

.122 (5,33)

.230

± .010

(0,25)

DIA

(0,51)

.020

(0,51)

.020

(0,64)

.025

(0,89)

.035

TAIL

(3,18)

.125

(4,57)

.180

OAL

(7,62)

.300

(8,89)

.350

–ZS, –ZU

(1,32)

.052

DIA

–ZA

–J

–K

(10,41) (15,24)

.410

.600

(12,95) (17,86)

.510

.703

Note:

Some sizes, styles and

options are non-standard,

non-returnable.

Styles J & K =16 oz/pin insertion force

Insertion Depth = .095" to .145",

Style ZS Component Part No. = EZ-1P1

Style ZA Component Part No. = EZ-6P1

Option L Component Part No.

= SC-1L1 or EZ-1L1

Insertion Depth = .095" to .138",

Style J Component Part No. = SC-1P3

Insertion Depth = .095" to .157",

Style K Component Part No. = SC-2P1

Insertion Depth = .105" to .170"

Component No. = EZ-3P1

WWW.SAMTEC.COM

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