SPST, 4 Func, 1 Channel, CMOS, PDSO14, 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Rochester Electronics |
Parts packaging code | SOIC |
package instruction | 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14 |
Contacts | 14 |
Reach Compliance Code | unknown |
Analog Integrated Circuits - Other Types | SPST |
JESD-30 code | R-PDSO-G14 |
JESD-609 code | e3 |
length | 10.2 mm |
Humidity sensitivity level | 1 |
Number of channels | 1 |
Number of functions | 4 |
Number of terminals | 14 |
On-state resistance matching specifications | 10 Ω |
Maximum on-state resistance (Ron) | 400 Ω |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 2.1 mm |
Maximum supply voltage (Vsup) | 15 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 10 V |
surface mount | YES |
Maximum disconnect time | 60 ns |
Maximum connection time | 60 ns |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 5.3 mm |
CD4066BCSJX | CD4066BCM | CD4066BCMX | CD4066BCN | CD4066BCSJ | |
---|---|---|---|---|---|
Description | SPST, 4 Func, 1 Channel, CMOS, PDSO14, 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14 | SPST, 4 Func, 1 Channel, CMOS, PDSO14, 0.150 INCH, MS-012, SOIC-14 | SPST, 4 Func, 1 Channel, CMOS, PDSO14, 0.150 INCH, MS-012, SOIC-14 | SPST, 4 Func, 1 Channel, CMOS, PDIP14, 0.300 INCH, PLASTIC, MS-001, DIP-14 | SPST, 4 Func, 1 Channel, CMOS, PDSO14, 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14 |
Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to |
Parts packaging code | SOIC | SOIC | SOIC | DIP | SOIC |
package instruction | 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14 | SOP, | 0.150 INCH, MS-012, SOIC-14 | DIP, | 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14 |
Contacts | 14 | 14 | 14 | 14 | 14 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPST | SPST |
JESD-30 code | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 |
JESD-609 code | e3 | e3 | e3 | e3 | e3 |
length | 10.2 mm | 8.6235 mm | 8.6235 mm | 19.18 mm | 10.2 mm |
Number of channels | 1 | 1 | 1 | 1 | 1 |
Number of functions | 4 | 4 | 4 | 4 | 4 |
Number of terminals | 14 | 14 | 14 | 14 | 14 |
On-state resistance matching specifications | 10 Ω | 10 Ω | 10 Ω | 10 Ω | 10 Ω |
Maximum on-state resistance (Ron) | 400 Ω | 400 Ω | 400 Ω | 400 Ω | 400 Ω |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | SOP | SOP | DIP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | NOT APPLICABLE | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 2.1 mm | 1.753 mm | 1.753 mm | 5.08 mm | 2.1 mm |
Maximum supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 10 V | 10 V | 10 V | 10 V | 10 V |
surface mount | YES | YES | YES | NO | YES |
Maximum disconnect time | 60 ns | 60 ns | 60 ns | 60 ns | 60 ns |
Maximum connection time | 60 ns | 60 ns | 60 ns | 60 ns | 60 ns |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | Matte Tin (Sn) | MATTE TIN | MATTE TIN | MATTE TIN | Matte Tin (Sn) |
Terminal form | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT APPLICABLE | NOT SPECIFIED |
width | 5.3 mm | 3.9 mm | 3.9 mm | 7.62 mm | 5.3 mm |
Maker | Rochester Electronics | - | Rochester Electronics | - | Rochester Electronics |
Humidity sensitivity level | 1 | 1 | 1 | - | 1 |
Base Number Matches | - | 1 | 1 | 1 | - |