SPST, 4 Func, 1 Channel, CMOS, PDIP14, 0.300 INCH, PLASTIC, MS-001, DIP-14
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 14 |
Reach Compliance Code | unknown |
Analog Integrated Circuits - Other Types | SPST |
JESD-30 code | R-PDIP-T14 |
JESD-609 code | e3 |
length | 19.18 mm |
Number of channels | 1 |
Number of functions | 4 |
Number of terminals | 14 |
On-state resistance matching specifications | 10 Ω |
Maximum on-state resistance (Ron) | 400 Ω |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT APPLICABLE |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 15 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 10 V |
surface mount | NO |
Maximum disconnect time | 60 ns |
Maximum connection time | 60 ns |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | MATTE TIN |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT APPLICABLE |
width | 7.62 mm |
Base Number Matches | 1 |
CD4066BCN | CD4066BCM | CD4066BCMX | CD4066BCSJ | CD4066BCSJX | |
---|---|---|---|---|---|
Description | SPST, 4 Func, 1 Channel, CMOS, PDIP14, 0.300 INCH, PLASTIC, MS-001, DIP-14 | SPST, 4 Func, 1 Channel, CMOS, PDSO14, 0.150 INCH, MS-012, SOIC-14 | SPST, 4 Func, 1 Channel, CMOS, PDSO14, 0.150 INCH, MS-012, SOIC-14 | SPST, 4 Func, 1 Channel, CMOS, PDSO14, 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14 | SPST, 4 Func, 1 Channel, CMOS, PDSO14, 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14 |
Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to |
Parts packaging code | DIP | SOIC | SOIC | SOIC | SOIC |
package instruction | DIP, | SOP, | 0.150 INCH, MS-012, SOIC-14 | 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14 | 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14 |
Contacts | 14 | 14 | 14 | 14 | 14 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPST | SPST |
JESD-30 code | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
JESD-609 code | e3 | e3 | e3 | e3 | e3 |
length | 19.18 mm | 8.6235 mm | 8.6235 mm | 10.2 mm | 10.2 mm |
Number of channels | 1 | 1 | 1 | 1 | 1 |
Number of functions | 4 | 4 | 4 | 4 | 4 |
Number of terminals | 14 | 14 | 14 | 14 | 14 |
On-state resistance matching specifications | 10 Ω | 10 Ω | 10 Ω | 10 Ω | 10 Ω |
Maximum on-state resistance (Ron) | 400 Ω | 400 Ω | 400 Ω | 400 Ω | 400 Ω |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | SOP | SOP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT APPLICABLE | 260 | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 1.753 mm | 1.753 mm | 2.1 mm | 2.1 mm |
Maximum supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 10 V | 10 V | 10 V | 10 V | 10 V |
surface mount | NO | YES | YES | YES | YES |
Maximum disconnect time | 60 ns | 60 ns | 60 ns | 60 ns | 60 ns |
Maximum connection time | 60 ns | 60 ns | 60 ns | 60 ns | 60 ns |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | MATTE TIN | MATTE TIN | MATTE TIN | Matte Tin (Sn) | Matte Tin (Sn) |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT APPLICABLE | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 7.62 mm | 3.9 mm | 3.9 mm | 5.3 mm | 5.3 mm |
Base Number Matches | 1 | 1 | 1 | - | - |
Humidity sensitivity level | - | 1 | 1 | 1 | 1 |
Maker | - | - | Rochester Electronics | Rochester Electronics | Rochester Electronics |
Part Number | Manufacturer | Description |
---|---|---|
CD4066BCN_NL | Fairchild | SPST, 4 Func, 1 Channel, CMOS, PDIP14, 0.300 INCH, PLASTIC, MS-001, DIP-14 |
MAX4583EUE+T | Maxim(美信半导体) | analog switch ics 3ch spdt low V analog switch |
MC74HC4051AN | Rochester Electronics | 8-CHANNEL, SGL ENDED MULTIPLEXER, PDIP16, PLASTIC, DIP-16 |
74HCT4053PW,118 | Nexperia | 逻辑类型:SPDT 额外特性:- |
CD74HC4066M96 | Texas Instruments(德州仪器) | 12-V, 1:1 (SPST), (SPST), 4-channel analog switch 14-SOIC -55 to 125 |
MAX4053AESE | Rochester Electronics | TRIPLE 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO16, 0.150 INCH, MS-012AC, SOIC-16 |
MC74HC4066ADG | ON Semiconductor(安森美) | 逻辑类型:SPST-常闭 额外特性:- |
74HCT4051BQ,115 | Nexperia | IC MUX/DEMUX 8X1 16DHVQFN |
SN74LV4053AN | Texas Instruments(德州仪器) | Triple 2-Channel Analog Multiplexer/Demultiplexer 16-PDIP -40 to 85 |
MAX4582CUE+ | Maxim(美信半导体) | Multiplexer Switch ICs 4:1 2Ch Low Voltage Analog MUX |
MAX4583ASE+ | Maxim(美信半导体) | Analog Switch ICs 3Ch SPDT Low V Analog Switch |
MAX4066ESD+ | Maxim(美信半导体) | |
SN74AHC4066DR | Texas Instruments(德州仪器) | Quadruple Bilateral Analog Switch 14-SOIC -40 to 85 |
MAX4052ACPE | Rochester Electronics | 8-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDIP16, 0.300 INCH, PLASTIC, MS-001AA, DIP-16 |