Telecom Circuit, 1-Func, MO-220, VFQFP-20
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Atmel (Microchip) |
| Parts packaging code | QFN |
| package instruction | HVQCCN, |
| Contacts | 20 |
| Reach Compliance Code | compliant |
| JESD-30 code | S-XQCC-N20 |
| JESD-609 code | e3 |
| length | 5 mm |
| Humidity sensitivity level | 2 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -25 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | HVQCCN |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 1 mm |
| Nominal supply voltage | 3 V |
| surface mount | YES |
| Telecom integrated circuit types | TELECOM CIRCUIT |
| Temperature level | OTHER |
| Terminal surface | MATTE TIN |
| Terminal form | NO LEAD |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 40 |
| width | 5 mm |
| T7024-PGSW | T7024-PGSM | |
|---|---|---|
| Description | Telecom Circuit, 1-Func, MO-220, VFQFP-20 | Telecom Circuit, 1-Func, MO-220, VFQFP-20 |
| Is it lead-free? | Lead free | Contains lead |
| Maker | Atmel (Microchip) | Atmel (Microchip) |
| Parts packaging code | QFN | QFN |
| package instruction | HVQCCN, | HVQCCN, |
| Contacts | 20 | 20 |
| Reach Compliance Code | compliant | unknown |
| JESD-30 code | S-XQCC-N20 | S-XQCC-N20 |
| JESD-609 code | e3 | e0 |
| length | 5 mm | 5 mm |
| Number of functions | 1 | 1 |
| Number of terminals | 20 | 20 |
| Maximum operating temperature | 70 °C | 70 °C |
| Minimum operating temperature | -25 °C | -25 °C |
| Package body material | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | HVQCCN | HVQCCN |
| Package shape | SQUARE | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 1 mm | 1 mm |
| Nominal supply voltage | 3 V | 3 V |
| surface mount | YES | YES |
| Telecom integrated circuit types | TELECOM CIRCUIT | TELECOM CIRCUIT |
| Temperature level | OTHER | OTHER |
| Terminal surface | MATTE TIN | TIN LEAD |
| Terminal form | NO LEAD | NO LEAD |
| Terminal pitch | 0.65 mm | 0.65 mm |
| Terminal location | QUAD | QUAD |
| Maximum time at peak reflow temperature | 40 | 30 |
| width | 5 mm | 5 mm |
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