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CY7C1357C-133AXI

Description
512KX18 ZBT SRAM, 6.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100
Categorystorage    storage   
File Size2MB,31 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Environmental Compliance  
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CY7C1357C-133AXI Overview

512KX18 ZBT SRAM, 6.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100

CY7C1357C-133AXI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerRochester Electronics
Parts packaging codeQFP
package instruction14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100
Contacts100
Reach Compliance Codeunknown
Maximum access time6.5 ns
Other featuresFLOW-THROUGH ARCHITECTURE
JESD-30 codeR-PQFP-G100
JESD-609 codee3
length20 mm
memory density9437184 bit
Memory IC TypeZBT SRAM
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals100
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX18
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusCOMMERCIAL
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width14 mm

CY7C1357C-133AXI Related Products

CY7C1357C-133AXI CY7C1355C-133BGXC CY7C1357C-100AXC
Description 512KX18 ZBT SRAM, 6.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 256KX36 ZBT SRAM, 6.5ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, BGA-119 512KX18 ZBT SRAM, 7.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100
Is it lead-free? Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to
Parts packaging code QFP BGA QFP
package instruction 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, BGA-119 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100
Contacts 100 119 100
Reach Compliance Code unknown unknown unknown
Maximum access time 6.5 ns 6.5 ns 7.5 ns
Other features FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE
JESD-30 code R-PQFP-G100 R-PBGA-B119 R-PQFP-G100
JESD-609 code e3 e1 e3
length 20 mm 22 mm 20 mm
memory density 9437184 bit 9437184 bit 9437184 bit
Memory IC Type ZBT SRAM ZBT SRAM ZBT SRAM
memory width 18 36 18
Humidity sensitivity level 3 3 3
Number of functions 1 1 1
Number of terminals 100 119 100
word count 524288 words 262144 words 524288 words
character code 512000 256000 512000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C
organize 512KX18 256KX36 512KX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP BGA LQFP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260
Certification status COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 1.6 mm 2.4 mm 1.6 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface MATTE TIN TIN SILVER COPPER MATTE TIN
Terminal form GULL WING BALL GULL WING
Terminal pitch 0.65 mm 1.27 mm 0.65 mm
Terminal location QUAD BOTTOM QUAD
Maximum time at peak reflow temperature 40 20 40
width 14 mm 14 mm 14 mm
Maker Rochester Electronics - Rochester Electronics

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