CY7C1355C-133BGXC datasheet, PDF

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CY7C1355C-133BGXC: Description256KX36 ZBT SRAM, 6.5ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, BGA-119; Categorystorage storage; File Size2MB，31 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/; Environmental Compliance

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CY7C1355C-133BGXC Overview

256KX36 ZBT SRAM, 6.5ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, BGA-119

CY7C1355C-133BGXC Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, BGA-119
Contacts	119
Reach Compliance Code	unknown
Is Samacsys	N
Maximum access time	6.5 ns
Other features	FLOW-THROUGH ARCHITECTURE
JESD-30 code	R-PBGA-B119
JESD-609 code	e1
length	22 mm
memory density	9437184 bit
Memory IC Type	ZBT SRAM
memory width	36
Humidity sensitivity level	3
Number of functions	1
Number of terminals	119
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX36
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Certification status	COMMERCIAL
Maximum seat height	2.4 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
Temperature level	COMMERCIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	14 mm
Base Number Matches	1

CY7C1355C-133BGXC Related Products

	CY7C1355C-133BGXC	CY7C1357C-100AXC	CY7C1357C-133AXI
Description	256KX36 ZBT SRAM, 6.5ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, BGA-119	512KX18 ZBT SRAM, 7.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100	512KX18 ZBT SRAM, 6.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100
Is it lead-free?	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to
Parts packaging code	BGA	QFP	QFP
package instruction	14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, BGA-119	14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100	14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100
Contacts	119	100	100
Reach Compliance Code	unknown	unknown	unknown
Maximum access time	6.5 ns	7.5 ns	6.5 ns
Other features	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE
JESD-30 code	R-PBGA-B119	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e1	e3	e3
length	22 mm	20 mm	20 mm
memory density	9437184 bit	9437184 bit	9437184 bit
Memory IC Type	ZBT SRAM	ZBT SRAM	ZBT SRAM
memory width	36	18	18
Humidity sensitivity level	3	3	3
Number of functions	1	1	1
Number of terminals	119	100	100
word count	262144 words	524288 words	524288 words
character code	256000	512000	512000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	85 °C
organize	256KX36	512KX18	512KX18
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	LQFP	LQFP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	260	260
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	2.4 mm	1.6 mm	1.6 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	TIN SILVER COPPER	MATTE TIN	MATTE TIN
Terminal form	BALL	GULL WING	GULL WING
Terminal pitch	1.27 mm	0.65 mm	0.65 mm
Terminal location	BOTTOM	QUAD	QUAD
Maximum time at peak reflow temperature	20	40	40
width	14 mm	14 mm	14 mm
Maker	-	Rochester Electronics	Rochester Electronics

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