IDT70V3399S133BFG8 datasheet, PDF

IDT70V3399S133BFG8: DescriptionDual-Port SRAM, 128KX18, 15ns, CMOS, PBGA208, FBGA-208; Categorystorage storage; File Size348KB，23 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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IDT70V3399S133BFG8 Overview

Dual-Port SRAM, 128KX18, 15ns, CMOS, PBGA208, FBGA-208

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
Parts packaging code	BGA
package instruction	TFBGA, BGA208,17X17,32
Contacts	208
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	15 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	133 MHz
I/O type	COMMON
JESD-30 code	S-PBGA-B208
JESD-609 code	e1
length	15 mm
memory density	2359296 bit
Memory IC Type	DUAL-PORT SRAM
memory width	18
Humidity sensitivity level	3
Number of functions	1
Number of ports	2
Number of terminals	208
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA208,17X17,32
Package shape	SQUARE
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.03 A
Minimum standby current	3.15 V
Maximum slew rate	0.4 mA
Maximum supply voltage (Vsup)	3.45 V
Minimum supply voltage (Vsup)	3.15 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	15 mm

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