USH5008-AI-C24 datasheet, PDF - EEWORLD Datasheet

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USH5008-AI-C24: DescriptionSPST, 1 Func, 8 Channel, CMOS, CDIP24, CERDIP-24; CategoryAnalog mixed-signal IC The signal circuit; File Size166KB，4 Pages; ManufacturerUniversal Semiconductor Inc

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USH5008-AI-C24 Overview

SPST, 1 Func, 8 Channel, CMOS, CDIP24, CERDIP-24

USH5008-AI-C24 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Universal Semiconductor Inc
Parts packaging code	DIP
package instruction	DIP, DIP24,.3
Contacts	24
Reach Compliance Code	unknown
Analog Integrated Circuits - Other Types	SPST
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
normal position	NO
Number of channels	8
Number of functions	1
Number of terminals	24
Nominal off-state isolation	45 dB
On-state resistance matching specifications	7 Ω
Maximum on-state resistance (Ron)	35 Ω
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
output	SEPARATE OUTPUT
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	15 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	15 V
surface mount	NO
Maximum disconnect time	5000 ns
Maximum connection time	5000 ns
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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USH5008-AI-C24 Related Products

	USH5008-AI-C24	USH5008-AI-K28	USH5008-AI-L28	USH5008-AI-P24	USH5008-AM-C24	USH5008-AM-L28
Description	SPST, 1 Func, 8 Channel, CMOS, CDIP24, CERDIP-24	SPST, 1 Func, 8 Channel, CMOS, PQCC28, PLASTIC, LCC-28	SPST, 1 Func, 8 Channel, CMOS, CQCC28, CERAMIC, CC-28	SPST, 1 Func, 8 Channel, CMOS, PDIP24, PLASTIC, DIP-24	SPST, 1 Func, 8 Channel, CMOS, CDIP24, CERDIP-24	SPST, 1 Func, 8 Channel, CMOS, CQCC28, CERAMIC, CC-28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Universal Semiconductor Inc	Universal Semiconductor Inc	Universal Semiconductor Inc	Universal Semiconductor Inc	Universal Semiconductor Inc	Universal Semiconductor Inc
Parts packaging code	DIP	QLCC	QFN	DIP	DIP	QFN
package instruction	DIP, DIP24,.3	QCCJ, LDCC(UNSPEC)	QCCN, LCC(UNSPEC)	DIP, DIP24,.3	DIP, DIP24,.3	QCCN, LCC(UNSPEC)
Contacts	24	28	28	24	24	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Analog Integrated Circuits - Other Types	SPST	SPST	SPST	SPST	SPST	SPST
JESD-30 code	R-GDIP-T24	S-PQCC-J28	S-CQCC-N28	R-PDIP-T24	R-GDIP-T24	S-CQCC-N28
JESD-609 code	e0	e0	e0	e0	e0	e0
normal position	NO	NO	NO	NO	NO	NO
Number of channels	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	24	28	28	24	24	28
Nominal off-state isolation	45 dB	45 dB	45 dB	45 dB	45 dB	45 dB
On-state resistance matching specifications	7 Ω	7 Ω	7 Ω	7 Ω	7 Ω	7 Ω
Maximum on-state resistance (Ron)	35 Ω	35 Ω	35 Ω	35 Ω	35 Ω	35 Ω
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	125 °C	125 °C
Minimum operating temperature	-25 °C	-	-25 °C	-	-55 °C	-55 °C
output	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	QCCJ	QCCN	DIP	DIP	QCCN
Encapsulate equivalent code	DIP24,.3	LDCC(UNSPEC)	LCC(UNSPEC)	DIP24,.3	DIP24,.3	LCC(UNSPEC)
Package shape	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	15 V	15 V	15 V	15 V	15 V	15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	15 V	15 V	15 V	15 V	15 V	15 V
surface mount	NO	YES	YES	NO	NO	YES
Maximum disconnect time	5000 ns	5000 ns	5000 ns	5000 ns	5000 ns	5000 ns
Maximum connection time	5000 ns	5000 ns	5000 ns	5000 ns	5000 ns	5000 ns
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	COMMERCIAL	OTHER	COMMERCIAL	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal location	DUAL	QUAD	QUAD	DUAL	DUAL	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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