SPST, 1 Func, 8 Channel, CMOS, CQCC28, CERAMIC, CC-28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Universal Semiconductor Inc |
Parts packaging code | QFN |
package instruction | QCCN, LCC(UNSPEC) |
Contacts | 28 |
Reach Compliance Code | unknown |
Analog Integrated Circuits - Other Types | SPST |
JESD-30 code | S-CQCC-N28 |
JESD-609 code | e0 |
normal position | NO |
Number of channels | 8 |
Number of functions | 1 |
Number of terminals | 28 |
Nominal off-state isolation | 45 dB |
On-state resistance matching specifications | 7 Ω |
Maximum on-state resistance (Ron) | 35 Ω |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
output | SEPARATE OUTPUT |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QCCN |
Encapsulate equivalent code | LCC(UNSPEC) |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 15 V |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 15 V |
surface mount | YES |
Maximum disconnect time | 5000 ns |
Maximum connection time | 5000 ns |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
USH5008-AM-L28 | USH5008-AI-C24 | USH5008-AI-K28 | USH5008-AI-L28 | USH5008-AI-P24 | USH5008-AM-C24 | |
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Description | SPST, 1 Func, 8 Channel, CMOS, CQCC28, CERAMIC, CC-28 | SPST, 1 Func, 8 Channel, CMOS, CDIP24, CERDIP-24 | SPST, 1 Func, 8 Channel, CMOS, PQCC28, PLASTIC, LCC-28 | SPST, 1 Func, 8 Channel, CMOS, CQCC28, CERAMIC, CC-28 | SPST, 1 Func, 8 Channel, CMOS, PDIP24, PLASTIC, DIP-24 | SPST, 1 Func, 8 Channel, CMOS, CDIP24, CERDIP-24 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Universal Semiconductor Inc | Universal Semiconductor Inc | Universal Semiconductor Inc | Universal Semiconductor Inc | Universal Semiconductor Inc | Universal Semiconductor Inc |
Parts packaging code | QFN | DIP | QLCC | QFN | DIP | DIP |
package instruction | QCCN, LCC(UNSPEC) | DIP, DIP24,.3 | QCCJ, LDCC(UNSPEC) | QCCN, LCC(UNSPEC) | DIP, DIP24,.3 | DIP, DIP24,.3 |
Contacts | 28 | 24 | 28 | 28 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPST | SPST | SPST |
JESD-30 code | S-CQCC-N28 | R-GDIP-T24 | S-PQCC-J28 | S-CQCC-N28 | R-PDIP-T24 | R-GDIP-T24 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
normal position | NO | NO | NO | NO | NO | NO |
Number of channels | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 24 | 28 | 28 | 24 | 24 |
Nominal off-state isolation | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB |
On-state resistance matching specifications | 7 Ω | 7 Ω | 7 Ω | 7 Ω | 7 Ω | 7 Ω |
Maximum on-state resistance (Ron) | 35 Ω | 35 Ω | 35 Ω | 35 Ω | 35 Ω | 35 Ω |
Maximum operating temperature | 125 °C | 85 °C | 70 °C | 85 °C | 70 °C | 125 °C |
Minimum operating temperature | -55 °C | -25 °C | - | -25 °C | - | -55 °C |
output | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
encapsulated code | QCCN | DIP | QCCJ | QCCN | DIP | DIP |
Encapsulate equivalent code | LCC(UNSPEC) | DIP24,.3 | LDCC(UNSPEC) | LCC(UNSPEC) | DIP24,.3 | DIP24,.3 |
Package shape | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
surface mount | YES | NO | YES | YES | NO | NO |
Maximum disconnect time | 5000 ns | 5000 ns | 5000 ns | 5000 ns | 5000 ns | 5000 ns |
Maximum connection time | 5000 ns | 5000 ns | 5000 ns | 5000 ns | 5000 ns | 5000 ns |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | OTHER | COMMERCIAL | OTHER | COMMERCIAL | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD | THROUGH-HOLE | J BEND | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
Terminal location | QUAD | DUAL | QUAD | QUAD | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |