MD8031AH-15B datasheet, PDF - EEWORLD Datasheet

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MD8031AH-15B: DescriptionMicrocontroller, 8-Bit, 8051 CPU, 15MHz, CMOS, CDIP40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size262KB，6 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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MD8031AH-15B Overview

Microcontroller, 8-Bit, 8051 CPU, 15MHz, CMOS, CDIP40

MD8031AH-15B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
package instruction	DIP, DIP40,.6
Reach Compliance Code	unknown
bit size	8
CPU series	8051
JESD-30 code	R-XDIP-T40
JESD-609 code	e0
Number of terminals	40
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	128
rom(word)	0
Filter level	MIL-STD-883 Class B (Modified)
speed	15 MHz
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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MD8031AH-15B Related Products

	MD8031AH-15B	MD8031	ID8031AH-12B	ID8031AH-12	IP8031AH-12B
Description	Microcontroller, 8-Bit, 8051 CPU, 15MHz, CMOS, CDIP40	Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDIP40	Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDIP40	Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDIP40	Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, PDIP40
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
bit size	8	8	8	8	8
CPU series	8051	8051	8051	8051	8051
JESD-30 code	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-XDIP-T40	R-PDIP-T40
JESD-609 code	e0	e0	e0	e0	e0
Number of terminals	40	40	40	40	40
Maximum operating temperature	125 °C	125 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6	DIP40,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V
RAM (bytes)	128	128	128	128	128
speed	15 MHz	12 MHz	12 MHz	12 MHz	12 MHz
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	AMD	-	AMD	AMD	AMD
Certification status	Not Qualified	Not Qualified	-	Not Qualified	-

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