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PZTM1101T/R

Description
TRANSISTOR 0.2 A, 40 V, NPN, Si, POWER TRANSISTOR, BIP General Purpose Power
CategoryDiscrete semiconductor    The transistor   
File Size37KB,7 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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PZTM1101T/R Overview

TRANSISTOR 0.2 A, 40 V, NPN, Si, POWER TRANSISTOR, BIP General Purpose Power

PZTM1101T/R Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
package instructionSMALL OUTLINE, R-PDSO-G4
Reach Compliance Codeunknown
ECCN codeEAR99
Shell connectionCOLLECTOR
Maximum collector current (IC)0.2 A
Collector-emitter maximum voltage40 V
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum DC current gain (hFE)30
JESD-30 codeR-PDSO-G4
JESD-609 codee3
Number of components1
Number of terminals4
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeNPN
Certification statusNot Qualified
surface mountYES
Terminal surfaceTIN
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON
Nominal transition frequency (fT)300 MHz

PZTM1101T/R Preview

DISCRETE SEMICONDUCTORS
DATA SHEET
k, halfpage
M3D087
PZTM1101
NPN transistor/Schottky-diode
module
Product specification
1996 May 09
Philips Semiconductors
Product specification
NPN transistor/Schottky-diode module
FEATURES
Low output capacitance
Fast switching time
Integrated Schottky protection
diode.
handbook, halfpage
PZTM1101
DESCRIPTION
Combination of an NPN transistor and a Schottky barrier diode in a plastic
SOT223 package. PNP complement: PZTM1102.
4
1
APPLICATIONS
High-speed switching for industrial
applications.
2
4
PINNING
PIN
1
2
3
4
base
emitter
collector, cathode Schottky
DESCRIPTION
anode Schottky
Marking code:
TM1101.
1
Top view
2
3
MAM236
3
Fig.1 Simplified outline (SOT223) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
NPN transistor
V
CBO
V
CES
V
EBO
I
C
V
R
I
F
I
F(AV)
T
j
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current (DC)
open emitter
V
BE
= 0
open collector
reverse current applied
forward current applied
Combined device
P
tot
T
amb
T
stg
T
j
total power dissipation
operating ambient temperature
storage temperature
junction temperature
up to T
amb
= 25
°C
−55
−55
1.2
+150
+150
150
W
°C
°C
°C
60
40
6
200
V
V
V
mA
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Schottky barrier diode
continuous reverse voltage
forward current (DC)
average forward current
junction temperature
40
1
1
125
150
V
A
A
°C
°C
1996 May 09
2
Philips Semiconductors
Product specification
NPN transistor/Schottky-diode module
ELECTRICAL CHARACTERISTICS
T
amb
= 25
°C
unless otherwise specified.
SYMBOL
NPN transistor
V
(BR)CBO
V
(BR)CES
V
(BR)EBO
I
CES
I
EBO
V
CEsat
collector-base breakdown voltage
open emitter; I
C
= 10
µA;
I
E
= 0;
T
amb
=
−55
to +150
°C;
note 1
60
40
6
300
40
70
100
30
60
15
PARAMETER
CONDITIONS
PZTM1101
MIN.
MAX.
100
50
50
10
200
300
250
350
850
950
1000
1100
4
8
300
500
5
31
310
100
UNIT
V
V
V
nA
µA
nA
µA
mV
mV
mV
mV
mV
mV
mV
mV
pF
pF
MHz
collector-emitter breakdown voltage open base; I
C
= 1 mA; V
BE
= 0;
T
amb
=
−55
to +150
°C;
note 1
emitter-base breakdown voltage
collector-emitter cut-off current
emitter-base cut-off current
collector-emitter saturation voltage
open collector; I
E
= 10
µA;
I
C
= 0;
T
amb
=
−55
to +150
°C;
note 1
V
CE
= 20 V; V
BE
= 0
V
EB
= 6 V; I
C
= 0
V
EB
= 6 V; I
C
= 0; T
amb
=
−55
to +150
°C
note 1
I
C
= 10 mA; I
B
= 1 mA
I
C
= 50 mA; I
B
= 3.2 mA
V
CE
= 20 V; V
BE
= 0; T
amb
=
−55
to +150
°C −
V
CEsat
collector-emitter saturation voltage
T
amb
=
−55
to +150
°C;
note 1
I
C
= 10 mA; I
B
= 1 mA
I
C
= 50 mA; I
B
= 3.2 mA
V
BEsat
base-emitter saturation voltage
note 1
I
C
= 10 mA; I
B
= 1 mA
I
C
= 50 mA; I
B
= 5 mA
V
BEsat
base-emitter saturation voltage
T
amb
=
−55
to +150
°C;
note 1
I
C
= 10 mA; I
B
= 1 mA
I
C
= 50 mA; I
B
= 5 mA
C
ob
C
ib
f
T
h
FE
output capacitance
input capacitance
transition frequency
DC current gain
I
E
= i
e
= 0; V
CB
= 5 V; f = 1 MHz
I
C
= i
c
= 0; V
EB
= 0.5 V; f = 1 MHz
I
C
= 10 mA; V
CE
= 20 V; f = 100 MHz
V
CE
= 1 V; note 1
I
C
= 0.1 mA
I
C
= 1 mA
I
C
= 10 mA
I
C
= 100 mA
h
FE
DC current gain
V
CE
= 1 V; T
amb
=
−55
to +150
°C;
note 1
I
C
= 10 mA
I
C
= 100 mA
S
WITCHING TIMES
(see Figs 2 and 3)
t
d
t
r
t
s
t
f
delay time
rise time
storage time
fall time
3
V
CC
= 5 V
I
C
= 50 mA
V
i
= 0 to 5 V
1
16
110
70
ns
ns
ns
ns
1996 May 09
Philips Semiconductors
Product specification
NPN transistor/Schottky-diode module
PZTM1101
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Schottky barrier diode
V
F
forward voltage
I
F
= 100 mA; note 1
I
F
= 100 mA; T
amb
=
−55
to +150
°C;
note 1
I
F
= 1 A; note 1
I
F
= 1 A; T
amb
=
−55
to +150
°C;
note 1
I
R
reverse current
V
R
= 40 V; note 1
V
R
= 40 V; T
j
= 125
°C;
T
amb
=
−55
to +150
°C;
note 1
I
R
reverse current
V
R
= 10 V; note 1
V
R
= 10 V; T
j
= 125
°C;
T
amb
=
−55
to +150
°C;
note 1
C
j
Notes
1. Measured under pulsed conditions: t
p
300
µs; δ ≤
0.01.
2. Limiting value for T
j
= 125
°C;
T
j
= 150
°C
with reverse current applied is not allowed as this may cause thermal
runaway leading to thermal destruction of the diode. A peak junction temperature of T
j
= 150
°C
is only allowed with
forward voltage applied.
THERMAL CHARACTERISTICS
SYMBOL
R
th j-a
Note
1. Refer to SOT223 standard mounting conditions.
PARAMETER
CONDITIONS
VALUE
100
UNIT
K/W
junction capacitance
V
R
= 0 V; f = 1 MHz
330
400
500
560
300
35
(2)
40
15
(2)
250
mV
mV
mV
mV
µA
mA
µA
mA
pF
thermal resistance from junction to ambient (combined device) note 1
1996 May 09
4
Philips Semiconductors
Product specification
NPN transistor/Schottky-diode module
GRAPHICAL DATA
PZTM1101
handbook, halfpage
handbook, halfpage
5V
VCC = 5 V DC
90
(1%)
INPUT
Vi
tp
Vo
OUTPUT
90%
td
tr
ton
ts
toff
10%
tf
MBH221
0V
5V
0V
825
(1%)
Vi
7.5 kΩ
(5%)
DUT
Vo (pin 4)
10%
90%
5.23
(1%)
MBH220
t
r
< 5 ns (10% to 90%); t
p
= 1
µs; δ
= 0.02; Z
i
= 50
Ω.
t
on
= t
d
+ t
r
; t
off
= t
s
+ t
f
.
Fig.2 Switching times test circuit.
Fig.3 Input and output waveforms.
1996 May 09
5

PZTM1101T/R Related Products

PZTM1101T/R PZTM1101/T3 PZTM1101,135 PZTM1101
Description TRANSISTOR 0.2 A, 40 V, NPN, Si, POWER TRANSISTOR, BIP General Purpose Power TRANSISTOR 0.2 A, 40 V, NPN, Si, POWER TRANSISTOR, BIP General Purpose Power PZTM1101 TRANSISTOR 0.2 A, 40 V, NPN, Si, POWER TRANSISTOR, PLASTIC PACKAGE-4, BIP General Purpose Power
Maker NXP NXP NXP NXP
package instruction SMALL OUTLINE, R-PDSO-G4 SMALL OUTLINE, R-PDSO-G4 SMALL OUTLINE, R-PDSO-G4 SMALL OUTLINE, R-PDSO-G4
Reach Compliance Code unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99
Shell connection COLLECTOR COLLECTOR COLLECTOR COLLECTOR
Maximum collector current (IC) 0.2 A 0.2 A 0.2 A 0.2 A
Collector-emitter maximum voltage 40 V 40 V 40 V 40 V
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
Minimum DC current gain (hFE) 30 30 30 30
JESD-30 code R-PDSO-G4 R-PDSO-G4 R-PDSO-G4 R-PDSO-G4
Number of components 1 1 1 1
Number of terminals 4 4 4 4
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Polarity/channel type NPN NPN NPN NPN
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal location DUAL DUAL DUAL DUAL
transistor applications SWITCHING SWITCHING SWITCHING SWITCHING
Transistor component materials SILICON SILICON SILICON SILICON
Nominal transition frequency (fT) 300 MHz 300 MHz 300 MHz 300 MHz
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