AM2911AFMB datasheet, PDF - EEWORLD Datasheet

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AM2911AFMB: DescriptionMicroprogram Sequencer, 4-Bit, TTL, PDFP20, FP-20; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，29 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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AM2911AFMB Overview

Microprogram Sequencer, 4-Bit, TTL, PDFP20, FP-20

AM2911AFMB Parametric

Parameter Name	Attribute value
Maker	Rochester Electronics
package instruction	DFP,
Reach Compliance Code	unknown
External data bus width	4
JESD-30 code	R-PDFP-F20
length	12.287 mm
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
Maximum seat height	2.159 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	6.731 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

AM2911AFMB Related Products

	AM2911AFMB	AM2911ALMB	AM2909ADMB	AM2909ALMB	AM2909APC	AM2911APC
Description	Microprogram Sequencer, 4-Bit, TTL, PDFP20, FP-20	Microprogram Sequencer, 4-Bit, TTL, CQCC20, LCC-20	Microprogram Sequencer, 4-Bit, TTL, CDIP28, HERMETIC SEALED, CERDIP-28	Microprogram Sequencer, 4-Bit, TTL, CQCC28, LCC-28	Microprogram Sequencer, 4-Bit, TTL, PDIP28, PLASTIC, DIP-28	Microprogram Sequencer, 4-Bit, TTL, PDIP20, PLASTIC, DIP-20
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
package instruction	DFP,	QCCN,	DIP,	QCCN,	DIP,	DIP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
External data bus width	4	4	4	4	4	4
JESD-30 code	R-PDFP-F20	S-CQCC-N20	R-GDIP-T28	S-CQCC-N28	R-PDIP-T28	R-PDIP-T20
length	12.287 mm	8.89 mm	37.211 mm	8.89 mm	37.338 mm	26.289 mm
Number of terminals	20	20	28	28	28	20
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-	-
Package body material	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DFP	QCCN	DIP	QCCN	DIP	DIP
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE
Maximum seat height	2.159 mm	2.54 mm	5.715 mm	2.54 mm	5.08 mm	5.08 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.25 V	5.25 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	YES	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL
Terminal form	FLAT	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL	QUAD	DUAL	DUAL
width	6.731 mm	8.89 mm	15.24 mm	8.89 mm	15.24 mm	7.62 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

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