AM2909ADMB datasheet, PDF - EEWORLD Datasheet

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AM2909ADMB: DescriptionMicroprogram Sequencer, 4-Bit, TTL, CDIP28, HERMETIC SEALED, CERDIP-28; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，29 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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AM2909ADMB Overview

Microprogram Sequencer, 4-Bit, TTL, CDIP28, HERMETIC SEALED, CERDIP-28

AM2909ADMB Parametric

Parameter Name	Attribute value
Maker	Rochester Electronics
package instruction	DIP,
Reach Compliance Code	unknown
External data bus width	4
JESD-30 code	R-GDIP-T28
length	37.211 mm
Number of terminals	28
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Maximum seat height	5.715 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

AM2909ADMB Related Products

	AM2909ADMB	AM2911ALMB	AM2909ALMB	AM2909APC	AM2911APC	AM2911AFMB
Description	Microprogram Sequencer, 4-Bit, TTL, CDIP28, HERMETIC SEALED, CERDIP-28	Microprogram Sequencer, 4-Bit, TTL, CQCC20, LCC-20	Microprogram Sequencer, 4-Bit, TTL, CQCC28, LCC-28	Microprogram Sequencer, 4-Bit, TTL, PDIP28, PLASTIC, DIP-28	Microprogram Sequencer, 4-Bit, TTL, PDIP20, PLASTIC, DIP-20	Microprogram Sequencer, 4-Bit, TTL, PDFP20, FP-20
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
package instruction	DIP,	QCCN,	QCCN,	DIP,	DIP,	DFP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
External data bus width	4	4	4	4	4	4
JESD-30 code	R-GDIP-T28	S-CQCC-N20	S-CQCC-N28	R-PDIP-T28	R-PDIP-T20	R-PDFP-F20
length	37.211 mm	8.89 mm	8.89 mm	37.338 mm	26.289 mm	12.287 mm
Number of terminals	28	20	28	28	20	20
Maximum operating temperature	125 °C	125 °C	125 °C	70 °C	70 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-	-	-55 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QCCN	QCCN	DIP	DIP	DFP
Package shape	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	FLATPACK
Maximum seat height	5.715 mm	2.54 mm	2.54 mm	5.08 mm	5.08 mm	2.159 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.25 V	5.25 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.75 V	4.75 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	NO	YES
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY
Terminal form	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	QUAD	QUAD	DUAL	DUAL	DUAL
width	15.24 mm	8.89 mm	8.89 mm	15.24 mm	7.62 mm	6.731 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

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