AM2909ALMB datasheet, PDF - EEWORLD Datasheet

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AM2909ALMB: DescriptionMicroprogram Sequencer, 4-Bit, TTL, CQCC28, LCC-28; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，29 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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AM2909ALMB Overview

Microprogram Sequencer, 4-Bit, TTL, CQCC28, LCC-28

AM2909ALMB Parametric

Parameter Name	Attribute value
Maker	Rochester Electronics
package instruction	QCCN,
Reach Compliance Code	unknown
External data bus width	4
JESD-30 code	S-CQCC-N28
length	8.89 mm
Number of terminals	28
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	SQUARE
Package form	CHIP CARRIER
Maximum seat height	2.54 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	8.89 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

AM2909ALMB Related Products

	AM2909ALMB	AM2911ALMB	AM2909ADMB	AM2909APC	AM2911APC	AM2911AFMB
Description	Microprogram Sequencer, 4-Bit, TTL, CQCC28, LCC-28	Microprogram Sequencer, 4-Bit, TTL, CQCC20, LCC-20	Microprogram Sequencer, 4-Bit, TTL, CDIP28, HERMETIC SEALED, CERDIP-28	Microprogram Sequencer, 4-Bit, TTL, PDIP28, PLASTIC, DIP-28	Microprogram Sequencer, 4-Bit, TTL, PDIP20, PLASTIC, DIP-20	Microprogram Sequencer, 4-Bit, TTL, PDFP20, FP-20
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
package instruction	QCCN,	QCCN,	DIP,	DIP,	DIP,	DFP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
External data bus width	4	4	4	4	4	4
JESD-30 code	S-CQCC-N28	S-CQCC-N20	R-GDIP-T28	R-PDIP-T28	R-PDIP-T20	R-PDFP-F20
length	8.89 mm	8.89 mm	37.211 mm	37.338 mm	26.289 mm	12.287 mm
Number of terminals	28	20	28	28	20	20
Maximum operating temperature	125 °C	125 °C	125 °C	70 °C	70 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-	-	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCN	QCCN	DIP	DIP	DIP	DFP
Package shape	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	FLATPACK
Maximum seat height	2.54 mm	2.54 mm	5.715 mm	5.08 mm	5.08 mm	2.159 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.25 V	5.25 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.75 V	4.75 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	NO	NO	YES
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY
Terminal form	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	QUAD	QUAD	DUAL	DUAL	DUAL	DUAL
width	8.89 mm	8.89 mm	15.24 mm	15.24 mm	7.62 mm	6.731 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

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