Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDIP28
Parameter Name | Attribute value |
Maker | Holtek |
Parts packaging code | DIP |
package instruction | DIP, DIP28,.3 |
Contacts | 28 |
Reach Compliance Code | unknown |
bit size | 8 |
JESD-30 code | R-PDIP-T28 |
Number of terminals | 28 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 3/5 V |
Certification status | Not Qualified |
RAM (bytes) | 384 |
rom(word) | 8192 |
ROM programmability | MROM |
speed | 8 MHz |
Maximum slew rate | 5 mA |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
HT46C24(28SKDIP) | HT46C24(48SSOP) | HT46C24(28SOP) | HT46R24(28SKDIP) | HT46R24(28SOP) | HT46R24(48SSOP) | |
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Description | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDIP28 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDSO48 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDSO28 | Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, PDIP28 | Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, PDSO28 | Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, PDSO48 |
Maker | Holtek | Holtek | Holtek | Holtek | Holtek | Holtek |
Parts packaging code | DIP | SSOP | SOIC | DIP | SOIC | SSOP |
package instruction | DIP, DIP28,.3 | SSOP, SSOP48,.4 | SOP, SOP28,.3 | DIP, DIP28,.3 | SOP, SOP28,.3 | SSOP, SSOP48,.4 |
Contacts | 28 | 48 | 28 | 28 | 28 | 48 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
bit size | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 code | R-PDIP-T28 | R-PDSO-G48 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G48 |
Number of terminals | 28 | 48 | 28 | 28 | 28 | 48 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SSOP | SOP | DIP | SOP | SSOP |
Encapsulate equivalent code | DIP28,.3 | SSOP48,.4 | SOP28,.3 | DIP28,.3 | SOP28,.3 | SSOP48,.4 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH |
power supply | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM (bytes) | 384 | 384 | 384 | 384 | 384 | 384 |
rom(word) | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
ROM programmability | MROM | MROM | MROM | UVPROM | UVPROM | UVPROM |
speed | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
Maximum slew rate | 5 mA | 5 mA | 5 mA | 5 mA | 5 mA | 5 mA |
surface mount | NO | YES | YES | NO | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
Terminal pitch | 2.54 mm | 0.635 mm | 1.27 mm | 2.54 mm | 1.27 mm | 0.635 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |