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HT46C24(28SKDIP)

Description
Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDIP28
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size369KB,51 Pages
ManufacturerHoltek
Websitehttp://www.holtek.com/
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HT46C24(28SKDIP) Overview

Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDIP28

HT46C24(28SKDIP) Parametric

Parameter NameAttribute value
MakerHoltek
Parts packaging codeDIP
package instructionDIP, DIP28,.3
Contacts28
Reach Compliance Codeunknown
bit size8
JESD-30 codeR-PDIP-T28
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply3/5 V
Certification statusNot Qualified
RAM (bytes)384
rom(word)8192
ROM programmabilityMROM
speed8 MHz
Maximum slew rate5 mA
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

HT46C24(28SKDIP) Related Products

HT46C24(28SKDIP) HT46C24(48SSOP) HT46C24(28SOP) HT46R24(28SKDIP) HT46R24(28SOP) HT46R24(48SSOP)
Description Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDIP28 Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDSO48 Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDSO28 Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, PDIP28 Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, PDSO28 Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, PDSO48
Maker Holtek Holtek Holtek Holtek Holtek Holtek
Parts packaging code DIP SSOP SOIC DIP SOIC SSOP
package instruction DIP, DIP28,.3 SSOP, SSOP48,.4 SOP, SOP28,.3 DIP, DIP28,.3 SOP, SOP28,.3 SSOP, SSOP48,.4
Contacts 28 48 28 28 28 48
Reach Compliance Code unknown unknown unknown unknown unknown unknown
bit size 8 8 8 8 8 8
JESD-30 code R-PDIP-T28 R-PDSO-G48 R-PDSO-G28 R-PDIP-T28 R-PDSO-G28 R-PDSO-G48
Number of terminals 28 48 28 28 28 48
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SSOP SOP DIP SOP SSOP
Encapsulate equivalent code DIP28,.3 SSOP48,.4 SOP28,.3 DIP28,.3 SOP28,.3 SSOP48,.4
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
power supply 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 384 384 384 384 384 384
rom(word) 8192 8192 8192 8192 8192 8192
ROM programmability MROM MROM MROM UVPROM UVPROM UVPROM
speed 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz
Maximum slew rate 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA
surface mount NO YES YES NO YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING
Terminal pitch 2.54 mm 0.635 mm 1.27 mm 2.54 mm 1.27 mm 0.635 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
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