Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, PDIP16
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Motorola ( NXP ) |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
Control type | ENABLE LOW |
JESD-30 code | R-PDIP-T16 |
JESD-609 code | e0 |
Logic integrated circuit type | BUS DRIVER |
Number of digits | 6 |
Number of functions | 2 |
Number of terminals | 16 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Output characteristics | 3-STATE |
Output polarity | INVERTED |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 2/6 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
MC74HC368NDS | MC74HC368NS | MC74HC368JS | |
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Description | Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, PDIP16 | Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, PDIP16 | Bus Driver, 2-Func, 6-Bit, Inverted Output, CMOS, CDIP16 |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Maker | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown |
Control type | ENABLE LOW | ENABLE LOW | ENABLE LOW |
JESD-30 code | R-PDIP-T16 | R-PDIP-T16 | R-XDIP-T16 |
JESD-609 code | e0 | e0 | e0 |
Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER |
Number of digits | 6 | 6 | 6 |
Number of functions | 2 | 2 | 2 |
Number of terminals | 16 | 16 | 16 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE |
Output polarity | INVERTED | INVERTED | INVERTED |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
encapsulated code | DIP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE |
power supply | 2/6 V | 2/6 V | 2/6 V |
surface mount | NO | NO | NO |
technology | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |
Certification status | - | Not Qualified | Not Qualified |