256K X 8 ELECTRICALLY ERASABLE EPROM
W27E020 | W27E020P-70 | W27E020P-12 | |
---|---|---|---|
Description | 256K X 8 ELECTRICALLY ERASABLE EPROM | 256K X 8 ELECTRICALLY ERASABLE EPROM | 256K X 8 ELECTRICALLY ERASABLE EPROM |
Is it Rohs certified? | - | incompatible | incompatible |
Maker | - | Winbond Electronics Corporation | Winbond Electronics Corporation |
Parts packaging code | - | QFJ | QFJ |
package instruction | - | PLASTIC, LCC-32 | PLASTIC, LCC-32 |
Contacts | - | 32 | 32 |
Reach Compliance Code | - | _compli | _compli |
ECCN code | - | 3A991.B.1.B.1 | 3A991.B.1.B.1 |
Maximum access time | - | 70 ns | 120 ns |
command user interface | - | NO | NO |
Data polling | - | NO | NO |
JESD-30 code | - | R-PQCC-J32 | R-PQCC-J32 |
JESD-609 code | - | e0 | e0 |
length | - | 13.97 mm | 13.97 mm |
memory density | - | 2097152 bi | 2097152 bi |
Memory IC Type | - | EEPROM | EEPROM |
memory width | - | 8 | 8 |
Number of functions | - | 1 | 1 |
Number of terminals | - | 32 | 32 |
word count | - | 262144 words | 262144 words |
character code | - | 256000 | 256000 |
Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | - | 70 °C | 70 °C |
organize | - | 256KX8 | 256KX8 |
Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | - | QCCJ | QCCJ |
Encapsulate equivalent code | - | LDCC32,.5X.6 | LDCC32,.5X.6 |
Package shape | - | RECTANGULAR | RECTANGULAR |
Package form | - | CHIP CARRIER | CHIP CARRIER |
Parallel/Serial | - | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED |
power supply | - | 5 V | 5 V |
Programming voltage | - | 12 V | 12 V |
Certification status | - | Not Qualified | Not Qualified |
Maximum seat height | - | 3.56 mm | 3.56 mm |
Maximum standby current | - | 0.0001 A | 0.0001 A |
Maximum slew rate | - | 0.03 mA | 0.03 mA |
Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | - | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | - | 5 V | 5 V |
surface mount | - | YES | YES |
technology | - | CMOS | CMOS |
Temperature level | - | COMMERCIAL | COMMERCIAL |
Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | - | J BEND | J BEND |
Terminal pitch | - | 1.27 mm | 1.27 mm |
Terminal location | - | QUAD | QUAD |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED |
switch bit | - | NO | NO |
width | - | 11.43 mm | 11.43 mm |