W27E020P-70 datasheet, PDF - EEWORLD Datasheet

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W27E020P-70: Description256K X 8 ELECTRICALLY ERASABLE EPROM; Categorystorage storage; File Size104KB，14 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W27E020P-70 Overview

256K X 8 ELECTRICALLY ERASABLE EPROM

W27E020P-70 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Winbond Electronics Corporation
Parts packaging code	QFJ
package instruction	PLASTIC, LCC-32
Contacts	32
Reach Compliance Code	_compli
ECCN code	3A991.B.1.B.1
Maximum access time	70 ns
command user interface	NO
Data polling	NO
JESD-30 code	R-PQCC-J32
JESD-609 code	e0
length	13.97 mm
memory density	2097152 bi
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX8
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC32,.5X.6
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	12 V
Certification status	Not Qualified
Maximum seat height	3.56 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	NO
width	11.43 mm

W27E020P-70 Related Products

	W27E020P-70	W27E020P-12	W27E020
Description	256K X 8 ELECTRICALLY ERASABLE EPROM	256K X 8 ELECTRICALLY ERASABLE EPROM	256K X 8 ELECTRICALLY ERASABLE EPROM
Is it Rohs certified?	incompatible	incompatible	-
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	-
Parts packaging code	QFJ	QFJ	-
package instruction	PLASTIC, LCC-32	PLASTIC, LCC-32	-
Contacts	32	32	-
Reach Compliance Code	_compli	_compli	-
ECCN code	3A991.B.1.B.1	3A991.B.1.B.1	-
Maximum access time	70 ns	120 ns	-
command user interface	NO	NO	-
Data polling	NO	NO	-
JESD-30 code	R-PQCC-J32	R-PQCC-J32	-
JESD-609 code	e0	e0	-
length	13.97 mm	13.97 mm	-
memory density	2097152 bi	2097152 bi	-
Memory IC Type	EEPROM	EEPROM	-
memory width	8	8	-
Number of functions	1	1	-
Number of terminals	32	32	-
word count	262144 words	262144 words	-
character code	256000	256000	-
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	70 °C	70 °C	-
organize	256KX8	256KX8	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	QCCJ	QCCJ	-
Encapsulate equivalent code	LDCC32,.5X.6	LDCC32,.5X.6	-
Package shape	RECTANGULAR	RECTANGULAR	-
Package form	CHIP CARRIER	CHIP CARRIER	-
Parallel/Serial	PARALLEL	PARALLEL	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	-
power supply	5 V	5 V	-
Programming voltage	12 V	12 V	-
Certification status	Not Qualified	Not Qualified	-
Maximum seat height	3.56 mm	3.56 mm	-
Maximum standby current	0.0001 A	0.0001 A	-
Maximum slew rate	0.03 mA	0.03 mA	-
Maximum supply voltage (Vsup)	5.5 V	5.5 V	-
Minimum supply voltage (Vsup)	4.5 V	4.5 V	-
Nominal supply voltage (Vsup)	5 V	5 V	-
surface mount	YES	YES	-
technology	CMOS	CMOS	-
Temperature level	COMMERCIAL	COMMERCIAL	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	J BEND	J BEND	-
Terminal pitch	1.27 mm	1.27 mm	-
Terminal location	QUAD	QUAD	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-
switch bit	NO	NO	-
width	11.43 mm	11.43 mm	-

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