MCK Series
B
SIP Sockets
MCK-ASGT-024
FEATURES:
The Augat VisInPak
™
Family allows gang mounting of socket terminals
without the need for a permanent insulator. The removable carrier
withstands temperatures up to 400°C, typical of soldering, vapor phase
and infrared processes.
• Various terminal choices provide a full range of mounting profiles.
• The Visual Inspection Package provides easy cleaning and
solder joint inspection.
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration
Type H, R, A .......... Passed MIL-STD-1344, Method 2005.1,
Condition III, 15 G’s
Type B .................... Passed MIL-STD-1344, Method 2005.1,
Condition V/J
Shock
Type H, R, A ............ Passed MIL-STD-1344, Method 2004.1,
Condition G, 100 G’s
Type B ...................... Passed MIL-STD-202F, Method 213,
Condition I
Durability ...................... Passed MIL-STD-1344, Method 2016
Normal Force
Type H & R .............. 115 Grams (4.1 oz.) with .018" (0,46) dia.
polished steel pin
Type B ...................... 238 Grams (8.4 oz.) with .018" (0,46) dia.
polished steel pin
Type A ...................... 35 Grams (1.2 oz.) with .018" (0,46) dia.
polished steel pin
Inner Contact
Retention .................... 7.5 Lbs. per line average
Solderability .................. Passed MIL-STD-202F, Method 208
Insertion Force with .018" (0,46) dia. polished steel pin
Type H ...................... 134 Grams (4.7 oz.)
Type R ...................... 179 Grams (6.3 oz.)
Type B ...................... 344 Grams (12.0 oz.)
Type A ...................... 81 Grams (2.9 oz.)
Withdrawal Force (with .018" dia. polished steel pin)
Type H ...................... 77 Grams (2.5 oz.)
Type R ...................... 63 Grams (2.2 oz.)
Type B ...................... 174 Grams (6.1 oz.)
Type A ...................... 50 Grams (1.8 oz.)
ELECTRICAL
Contact Resistance ........ 10 Milliohms
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD-202F, Method 305
(contact to contact)
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1
Operation Temp. ............ Gold inner contact -55°C to +125°C,
Tin/lead inner contact -55°C to +105°C
APPLICATION DIMENSIONS:
Contact Styles H, R, B
• PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34)
• IC Pin Dimension Range: .016" x .021" (0,41 x 0,53) round lead
.105" (2,67) min. length
Contact Style A
• PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34)
• IC Pin Dimension Range: .016" to .019" (0,41 x 0,48) round lead
.100" (2,54) min. length
MATERIAL SPECIFICATIONS:
Insulator ........................ KAPTON™ or equivalent
Inner Contact .................. Beryllium copper, or tin/lead plated
Outer Sleeve .................. Brass or copper, gold or tin/lead plated
Kapton™ is a registered trademark of the DuPont Company.
Quality & Innovation From The
Product Group
B4
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
FPGA/CPLD
京公网安备 11010802033920号
EEWORLD
