AM7203-25DC datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> AM7203-25DC

AM7203-25DC: DescriptionFIFO, 2KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28; Categorystorage storage; File Size1021KB，20 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

Download Datasheet Parametric Compare View All

AM7203-25DC Overview

FIFO, 2KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28

AM7203-25DC Parametric

Parameter Name	Attribute value
Maker	Rochester Electronics
package instruction	DIP,
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	25 ns
period time	35 ns
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
length	37.1475 mm
memory density	18432 bit
memory width	9
Number of functions	1
Number of terminals	28
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2KX9
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Maximum seat height	5.588 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

Preview

Download Datasheet

View All

AM7203-25DC Related Products

	AM7203-25DC	AM7203-65/BXA	AM7203-65DC	AM7203-65PC	AM7203-80/BXA	AM7203-80DC	AM7203-35PC	AM7203-50/BXA	AM7203-25JC
Description	FIFO, 2KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28	FIFO, 2KX9, 65ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28	FIFO, 2KX9, 65ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28	FIFO, 2KX9, 65ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 2KX9, 80ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28	FIFO, 2KX9, 80ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28	FIFO, 2KX9, 35ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 2KX9, 50ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28	FIFO, 2KX9, 25ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
package instruction	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	QCCJ,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	25 ns	65 ns	65 ns	65 ns	80 ns	80 ns	35 ns	50 ns	25 ns
period time	35 ns	80 ns	80 ns	80 ns	100 ns	100 ns	45 ns	65 ns	35 ns
JESD-30 code	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-PDIP-T28	R-GDIP-T28	R-GDIP-T28	R-PDIP-T28	R-GDIP-T28	R-PQCC-J32
length	37.1475 mm	37.1475 mm	37.1475 mm	37.084 mm	37.1475 mm	37.1475 mm	37.084 mm	37.1475 mm	13.97 mm
memory density	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit
memory width	9	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28	32
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	125 °C	70 °C	70 °C	125 °C	70 °C	70 °C	125 °C	70 °C
organize	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9
Exportable	NO	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Maximum seat height	5.588 mm	5.588 mm	5.588 mm	5.715 mm	5.588 mm	5.588 mm	5.715 mm	5.588 mm	3.556 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	11.43 mm
JESD-609 code	e0	e0	e0	e0	e0	e0	-	e0	-
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	-	TIN LEAD	-

Recommended Resources

TDA1701 power amplifier circuit diagram

Detection circuit of sensor bridge signal

Sony KV-J29 color TV protection circuit

555 simple temperature controller (1)

Digitally controlled l00kHz oscillator circuit

6OXT(1.0) computer motherboard circuit diagram_27

Next-Generation C2000 Microcontrollers and CapTIvate Technology Live Broadcast Registration Open!: TI's new C2000 microcontrollers and CapTIvate technology online live broadcast registration is now open!In this two live broadcasts, you will learnLeverage the latest C2000 family products to achieve ...; Jacktang Microcontroller MCU

Regarding impedance matching, is the characteristic impedance setting of the board trace the same as the series resistor impedance matching?: [i=s]This post was last edited by shijizai on 2019-9-26 08:54[/i]1. "Single-ended lines are matched to 50 ohms impedance , and differential pairs are matched to 100 ohms impedance ." Should this sente...; shijizai PCB Design

EEWORLD University Hall----Live Replay: TI chip technology helps motor development: Live replay: TI chip technology helps motor development : https://training.eeworld.com.cn/course/67821...; hi5 Talking

ADC Test Voltage vs. Temperature: This article records the ADC test voltage and temperature measurement functions1. Configure a single channel of the ADC rule group as a voltage test, and configure a single channel of the ADC injectio...; eew_xQfw2M GD32 MCU

About packaging: After drawing a pad, there is a red layer on the top and a purple layer on the bottom. I would like to ask if the purple layer is the pad. When drawing the package, should the size on the right be fil...; 乐乐老了 PCB Design

[Information] The latest domestic card swiping chip (ultra-low power consumption 13.56M chip): SI522 (ultra-low power 13.56M chip) replaces rc522 and is fully compatible with PIN to PIN. SI522 is a member of the highly integrated card reader and writer series chips used in 13.56MHz contactless ...; Pingannnm RF/Wirelessly

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components