AM7203-80/BXA datasheet, PDF - EEWORLD Datasheet

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AM7203-80/BXA: DescriptionFIFO, 2KX9, 80ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28; Categorystorage storage; File Size1021KB，20 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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AM7203-80/BXA Overview

FIFO, 2KX9, 80ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28

AM7203-80/BXA Parametric

Parameter Name	Attribute value
Maker	Rochester Electronics
package instruction	DIP,
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	80 ns
period time	100 ns
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
length	37.1475 mm
memory density	18432 bit
memory width	9
Number of functions	1
Number of terminals	28
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX9
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Maximum seat height	5.588 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

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AM7203-80/BXA Related Products

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Description	FIFO, 2KX9, 80ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28	FIFO, 2KX9, 65ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28	FIFO, 2KX9, 65ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28	FIFO, 2KX9, 65ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 2KX9, 80ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28	FIFO, 2KX9, 25ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28	FIFO, 2KX9, 35ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 2KX9, 50ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28	FIFO, 2KX9, 25ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
package instruction	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	QCCJ,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	80 ns	65 ns	65 ns	65 ns	80 ns	25 ns	35 ns	50 ns	25 ns
period time	100 ns	80 ns	80 ns	80 ns	100 ns	35 ns	45 ns	65 ns	35 ns
JESD-30 code	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-PDIP-T28	R-GDIP-T28	R-GDIP-T28	R-PDIP-T28	R-GDIP-T28	R-PQCC-J32
length	37.1475 mm	37.1475 mm	37.1475 mm	37.084 mm	37.1475 mm	37.1475 mm	37.084 mm	37.1475 mm	13.97 mm
memory density	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit
memory width	9	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28	32
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	70 °C	70 °C	70 °C	70 °C	70 °C	125 °C	70 °C
organize	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9
Exportable	NO	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Maximum seat height	5.588 mm	5.588 mm	5.588 mm	5.715 mm	5.588 mm	5.588 mm	5.715 mm	5.588 mm	3.556 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	11.43 mm
JESD-609 code	e0	e0	e0	e0	e0	e0	-	e0	-
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	-	TIN LEAD	-

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