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EMCL23H2J-161.1328MTR

Description
CRYSTAL OSCILLATOR, CLOCK, 161.1328MHz, LVPECL OUTPUT, ROHS COMPLIANT, PLASTIC, SMD, 6 PIN
CategoryPassive components    oscillator   
File Size236KB,6 Pages
ManufacturerECLIPTEK
Websitehttp://www.ecliptek.com
Environmental Compliance  
Download Datasheet Parametric View All

EMCL23H2J-161.1328MTR Overview

CRYSTAL OSCILLATOR, CLOCK, 161.1328MHz, LVPECL OUTPUT, ROHS COMPLIANT, PLASTIC, SMD, 6 PIN

EMCL23H2J-161.1328MTR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerECLIPTEK
Reach Compliance Codecompliant
Other featuresCOMPLEMENTARY OUTPUT; TAPE AND REEL
maximum descent time0.3 ns
Frequency Adjustment - MechanicalNO
frequency stability50%
JESD-609 codee4
Manufacturer's serial numberEMCL23
Installation featuresSURFACE MOUNT
Nominal operating frequency161.1328 MHz
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Oscillator typeLVPECL
Output load50 OHM
physical size5.0mm x 3.2mm x 0.75mm
longest rise time0.3 ns
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
maximum symmetry55/45 %
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)

EMCL23H2J-161.1328MTR Preview

EMCL23H2J-161.1328M TR
Series
RoHS Compliant (Pb-free) 3.3V 6 Pad 3.2mm x 5mm
Plastic SMD LVPECL MEMS Oscillator
Frequency Tolerance/Stability
±50ppm Maximum over -40°C to +85°C
Duty Cycle
50 ±5(%)
RoHS
Pb
Packaging Options
Tape & Reel
EMCL23 H 2 J -161.1328M TR
Nominal Frequency
161.1328MHz
Logic Control / Additional Output
Standby (ST) and Complementary Output
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
161.1328MHz
±50ppm Maximum over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance at 25°C,
Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,
1st Year Aging at 25°C, Reflow, Shock, and Vibration)
±1ppm First Year Maximum
+3.3Vdc ±0.3Vdc
80mA Maximum (Excluding Load Termination Current)
2.35Vdc Typical, Vcc-1.025Vdc Minimum
1.6Vdc Typical, Vcc-1.62Vdc Maximum
150pSec Typical, 300pSec Maximum (Measured over 20% to 80% of waveform)
50 ±5(%) (Measured at 50% of waveform)
50 Ohms into Vcc-2.0Vdc
LVPECL
Standby (ST) and Complementary Output
Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc
Maximum to Disable Output and Complementary Output (High Impedance)
30µA Maximum (ST) Without Load
0.2pSec Typical
2.0pSec Typical
1.5pSec Typical, 3.0pSec Maximum
20pSec Typical, 25pSec Maximum
1.6pSec Typical
0.7pSec Typical
0.4pSec Typical
10mSec Maximum
-55°C to +125°C
Aging at 25°C
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Logic Control / Additional Output
Output Control Input Voltage
Standby Current
Period Jitter (Deterministic)
Period Jitter (Random)
Period Jitter (RMS)
Period Jitter (pk-pk)
RMS Phase Jitter (Fj = 637kHz to
10MHz; Random)
RMS Phase Jitter (Fj = 1MHz to
20MHz; Random)
RMS Phase Jitter (Fj = 1.875MHz to
20MHz; Random)
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Flammability
Mechanical Shock
Moisture Resistance
Moisture Sensitivity Level
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Thermal Shock
Vibration
MIL-STD-883, Method 3015, Class 2, HBM 2000V
UL94-V0
MIL-STD-883, Method 2002, Condition G, 30,000G
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003 (Pads on bottom of package only)
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 1011, Condition B
MIL-STD-883, Method 2007, Condition A, 20G
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 1 of 6
EMCL23H2J-161.1328M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
CONNECTION
Standby (ST)
No Connect
Case Ground
Output
Complementary Output
Supply Voltage
3.20
±0.15
0.75
±0.15
3
1.00 ±0.10 (x6)
2
3
4
5
6
4
5
6
0.64
±0.10 (x6)
5.00
±0.15
2.54
±0.10
1.27 TYP
(x4)
1.20
±0.10
2
1
LINE MARKING
1
XXXXX
XXXXX=Ecliptek
Manufacturing Lot Code
0.08 MAX
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.40 (X6)
1.00 (X6)
0.27 (X4)
0.80 (X2)
All Tolerances are ±0.1
Solder Land
(X6)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 2 of 6
EMCL23H2J-161.1328M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
TRI-STATE INPUT
V
IH
V
IL
CLOCK OUTPUTS
V
OH
80%
50%
20%
V
OL
Q
OUTPUT STANDBY
(HIGH IMPEDANCE
STATE)
Q
t
PLZ
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
t
PZL
Test Circuit for Tri-State and Complementary Output
50 Ohms
Pin Connections
1 Tri-State
2 No Connect
3 Ground
4 Output
5 Complementary Output
6 Supply Voltage (V
DD
)
Oscilloscope
Frequency
Counter
Power
Supply
Supply
Voltage
(V
DD
)
Current
Meter
0.01µF
(Note 1)
0.1µF
(Note 1)
Complementary
Output
Probe 2
(Note 2)
Output
Probe 1
(Note 2)
50 Ohms
Switch
Power
Supply
Voltage
Meter
Power
Supply
Ground
Tri-State
No
Connect
Power
Supply
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm)
to the package ground and supply voltage pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is
recommended.
Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 3 of 6
EMCL23H2J-161.1328M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.1
2.0 ±0.1
DIA 1.5 +0.1/-0
0.30 ±0.05
5.5 ±0.1
12.0 ±0.2
6.5 ±0.1
A0*
8.0 ±0.2
*Compliant to EIA 481A
B0*
K0*
1.5 MIN
DIA 40 MIN
Access Hole at
Slot Location
18.4 MAX
180 MAX
DIA 50 MIN
DIA 20.2 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
12.4 +2.0/-0
DIA 13.0 ±0.2
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 4 of 6
EMCL23H2J-161.1328M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 5 of 6
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