GS8180S09B-333 datasheet, PDF - EEWORLD Datasheet

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GS8180S09B-333: DescriptionLate-Write SRAM, 2MX9, 1.6ns, CMOS, PBGA209; Categorystorage storage; File Size681KB，32 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS8180S09B-333 Overview

Late-Write SRAM, 2MX9, 1.6ns, CMOS, PBGA209

GS8180S09B-333 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	GSI Technology
package instruction	BGA, BGA209,11X19,50
Reach Compliance Code	compliant
Maximum access time	1.6 ns
Maximum clock frequency (fCLK)	333 MHz
I/O type	SEPARATE
JESD-30 code	R-PBGA-B209
JESD-609 code	e0
memory density	18874368 bit
Memory IC Type	LATE-WRITE SRAM
memory width	9
Humidity sensitivity level	3
Number of terminals	209
word count	2097152 words
character code	2000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX9
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA209,11X19,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
power supply	1.5/1.8,1.8 V
Certification status	Not Qualified
Minimum standby current	1.7 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM

GS8180S09B-333 Related Products

	GS8180S09B-333	GS8180S09B-275IT	GS8180S09B-250T	GS8180S09B-300I	GS8180S09B-300	GS8180S09B-250
Description	Late-Write SRAM, 2MX9, 1.6ns, CMOS, PBGA209	Late-Write SRAM, 2MX9, 1.9ns, CMOS, PBGA209	Late-Write SRAM, 2MX9, 2.1ns, CMOS, PBGA209	Late-Write SRAM, 2MX9, 1.8ns, CMOS, PBGA209	Late-Write SRAM, 2MX9, 1.8ns, CMOS, PBGA209	Late-Write SRAM, 2MX9, 2.1ns, CMOS, PBGA209
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology
package instruction	BGA, BGA209,11X19,50	BGA, BGA209,11X19,50	BGA, BGA209,11X19,50	BGA, BGA209,11X19,50	BGA, BGA209,11X19,50	BGA, BGA209,11X19,50
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
Maximum access time	1.6 ns	1.9 ns	2.1 ns	1.8 ns	1.8 ns	2.1 ns
Maximum clock frequency (fCLK)	333 MHz	275 MHz	250 MHz	300 MHz	300 MHz	250 MHz
I/O type	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-PBGA-B209	R-PBGA-B209	R-PBGA-B209	R-PBGA-B209	R-PBGA-B209	R-PBGA-B209
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit
Memory IC Type	LATE-WRITE SRAM	LATE-WRITE SRAM	LATE-WRITE SRAM	LATE-WRITE SRAM	LATE-WRITE SRAM	LATE-WRITE SRAM
memory width	9	9	9	9	9	9
Humidity sensitivity level	3	3	3	3	3	3
Number of terminals	209	209	209	209	209	209
word count	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000	2000000	2000000	2000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C	70 °C	70 °C
organize	2MX9	2MX9	2MX9	2MX9	2MX9	2MX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA209,11X19,50	BGA209,11X19,50	BGA209,11X19,50	BGA209,11X19,50	BGA209,11X19,50	BGA209,11X19,50
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	1.5/1.8,1.8 V	1.5/1.8,1.8 V	1.5/1.8,1.8 V	1.5/1.8,1.8 V	1.5/1.8,1.8 V	1.5/1.8,1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Minimum standby current	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM

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