8-BIT, FLASH, 24 MHz, MICROCONTROLLER, QCC32, LEAD FREE, MO-220, QFN-32
Parameter Name | Attribute value |
Maker | Rochester Electronics |
Parts packaging code | QFN |
package instruction | HVQCCN, |
Contacts | 32 |
Reach Compliance Code | unknown |
Has ADC | NO |
Address bus width | |
bit size | 8 |
maximum clock frequency | 24 MHz |
DAC channel | NO |
DMA channel | NO |
External data bus width | |
JESD-30 code | S-XQCC-N32 |
length | 5 mm |
Number of I/O lines | 20 |
Number of terminals | 32 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
PWM channel | NO |
Package body material | UNSPECIFIED |
encapsulated code | HVQCCN |
Package shape | SQUARE |
Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
ROM programmability | FLASH |
Maximum seat height | 1 mm |
speed | 24 MHz |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
width | 5 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
CY7C63833-LTXC | CY7C63823-QXC | CY7C63803-SXC | CY7C63803-LQXC | CY7C63813-PXC | CY7C63310-SXC | CY7C63801-SXC | CY7C63823-SXC | |
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Description | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, QCC32, LEAD FREE, MO-220, QFN-32 | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PDSO24, LEAD FREE, QSOP-24 | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PDSO16, 0.150 INCH, LEAD FREE, MS-012, SOIC-16 | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, QCC24, LEAD FREE, MO-248, QFN-24 | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PDIP18, 0.300 INCH, LEAD FREE, PLASTIC, DIP-18 | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PDSO16, 0.150 INCH, LEAD FREE, MS-012, SOIC-16 | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PDSO16, 0.150 INCH, LEAD FREE, MS-012, SOIC-16 | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PDSO24, 0.300 INCH, LEAD FREE, MO-119, SOIC-24 |
Parts packaging code | QFN | SOIC | SOIC | QFN | DIP | SOIC | SOIC | SOIC |
package instruction | HVQCCN, | SSOP, | SOP, | HVQCCN, | DIP, | SOP, | SOP, | SOP, |
Contacts | 32 | 24 | 16 | 24 | 18 | 16 | 16 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Has ADC | NO | NO | NO | NO | NO | NO | NO | NO |
bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
maximum clock frequency | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz |
DAC channel | NO | NO | NO | NO | NO | NO | NO | NO |
DMA channel | NO | NO | NO | NO | NO | NO | NO | NO |
JESD-30 code | S-XQCC-N32 | R-PDSO-G24 | R-PDSO-G16 | S-XQCC-N24 | R-PDIP-T18 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G24 |
length | 5 mm | 8.6487 mm | 9.893 mm | 4 mm | 22.733 mm | 9.893 mm | 9.893 mm | 15.392 mm |
Number of I/O lines | 20 | 20 | 14 | 14 | 16 | 14 | 14 | 20 |
Number of terminals | 32 | 24 | 16 | 24 | 18 | 16 | 16 | 24 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
PWM channel | NO | NO | NO | NO | NO | NO | NO | NO |
Package body material | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | HVQCCN | SSOP | SOP | HVQCCN | DIP | SOP | SOP | SOP |
Package shape | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
ROM programmability | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
Maximum seat height | 1 mm | 1.7526 mm | 1.727 mm | 0.6 mm | 4.826 mm | 1.727 mm | 1.727 mm | 2.667 mm |
speed | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz |
Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | NO | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | GULL WING | GULL WING | NO LEAD | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.5 mm | 0.635 mm | 1.27 mm | 0.5 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
width | 5 mm | 3.89 mm | 3.89 mm | 4 mm | 7.62 mm | 3.89 mm | 3.89 mm | 7.5055 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Maker | Rochester Electronics | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
Is it lead-free? | - | Lead free | Lead free | - | Lead free | Lead free | Lead free | Lead free |
Is it Rohs certified? | - | conform to | conform to | - | conform to | conform to | conform to | conform to |
JESD-609 code | - | e4 | e3 | - | e3 | e3 | e3 | e4 |
Humidity sensitivity level | - | 1 | 3 | - | 1 | 3 | 3 | 3 |
Peak Reflow Temperature (Celsius) | - | 260 | 260 | - | 260 | 260 | 260 | 260 |
Terminal surface | - | NICKEL PALLADIUM GOLD | MATTE TIN | - | MATTE TIN | MATTE TIN | MATTE TIN | NICKEL PALLADIUM GOLD |
Maximum time at peak reflow temperature | - | 20 | 40 | - | 20 | 40 | 40 | 20 |