8-BIT, FLASH, 24 MHz, MICROCONTROLLER, QCC24, LEAD FREE, MO-248, QFN-24
| Parameter Name | Attribute value |
| Maker | Rochester Electronics |
| Parts packaging code | QFN |
| package instruction | HVQCCN, |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| Has ADC | NO |
| Address bus width | |
| bit size | 8 |
| maximum clock frequency | 24 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | S-XQCC-N24 |
| length | 4 mm |
| Number of I/O lines | 14 |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| PWM channel | NO |
| Package body material | UNSPECIFIED |
| encapsulated code | HVQCCN |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| ROM programmability | FLASH |
| Maximum seat height | 0.6 mm |
| speed | 24 MHz |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| width | 4 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| CY7C63803-LQXC | CY7C63823-QXC | CY7C63803-SXC | CY7C63813-PXC | CY7C63833-LTXC | CY7C63310-SXC | CY7C63801-SXC | CY7C63823-SXC | |
|---|---|---|---|---|---|---|---|---|
| Description | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, QCC24, LEAD FREE, MO-248, QFN-24 | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PDSO24, LEAD FREE, QSOP-24 | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PDSO16, 0.150 INCH, LEAD FREE, MS-012, SOIC-16 | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PDIP18, 0.300 INCH, LEAD FREE, PLASTIC, DIP-18 | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, QCC32, LEAD FREE, MO-220, QFN-32 | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PDSO16, 0.150 INCH, LEAD FREE, MS-012, SOIC-16 | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PDSO16, 0.150 INCH, LEAD FREE, MS-012, SOIC-16 | 8-BIT, FLASH, 24 MHz, MICROCONTROLLER, PDSO24, 0.300 INCH, LEAD FREE, MO-119, SOIC-24 |
| Parts packaging code | QFN | SOIC | SOIC | DIP | QFN | SOIC | SOIC | SOIC |
| package instruction | HVQCCN, | SSOP, | SOP, | DIP, | HVQCCN, | SOP, | SOP, | SOP, |
| Contacts | 24 | 24 | 16 | 18 | 32 | 16 | 16 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Has ADC | NO | NO | NO | NO | NO | NO | NO | NO |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| maximum clock frequency | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz |
| DAC channel | NO | NO | NO | NO | NO | NO | NO | NO |
| DMA channel | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 code | S-XQCC-N24 | R-PDSO-G24 | R-PDSO-G16 | R-PDIP-T18 | S-XQCC-N32 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G24 |
| length | 4 mm | 8.6487 mm | 9.893 mm | 22.733 mm | 5 mm | 9.893 mm | 9.893 mm | 15.392 mm |
| Number of I/O lines | 14 | 20 | 14 | 16 | 20 | 14 | 14 | 20 |
| Number of terminals | 24 | 24 | 16 | 18 | 32 | 16 | 16 | 24 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| PWM channel | NO | NO | NO | NO | NO | NO | NO | NO |
| Package body material | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | HVQCCN | SSOP | SOP | DIP | HVQCCN | SOP | SOP | SOP |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| ROM programmability | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| Maximum seat height | 0.6 mm | 1.7526 mm | 1.727 mm | 4.826 mm | 1 mm | 1.727 mm | 1.727 mm | 2.667 mm |
| speed | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | GULL WING | GULL WING | THROUGH-HOLE | NO LEAD | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.5 mm | 0.635 mm | 1.27 mm | 2.54 mm | 0.5 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
| width | 4 mm | 3.89 mm | 3.89 mm | 7.62 mm | 5 mm | 3.89 mm | 3.89 mm | 7.5055 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Maker | Rochester Electronics | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| Is it lead-free? | - | Lead free | Lead free | Lead free | - | Lead free | Lead free | Lead free |
| Is it Rohs certified? | - | conform to | conform to | conform to | - | conform to | conform to | conform to |
| JESD-609 code | - | e4 | e3 | e3 | - | e3 | e3 | e4 |
| Humidity sensitivity level | - | 1 | 3 | 1 | - | 3 | 3 | 3 |
| Peak Reflow Temperature (Celsius) | - | 260 | 260 | 260 | - | 260 | 260 | 260 |
| Terminal surface | - | NICKEL PALLADIUM GOLD | MATTE TIN | MATTE TIN | - | MATTE TIN | MATTE TIN | NICKEL PALLADIUM GOLD |
| Maximum time at peak reflow temperature | - | 20 | 40 | 20 | - | 40 | 40 | 20 |
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