KMPC8250ACVRIHBB datasheet, PDF

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KMPC8250ACVRIHBB: DescriptionIC,MICROPROCESSOR,32-BIT,BGA,516PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size727KB，60 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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KMPC8250ACVRIHBB Overview

IC,MICROPROCESSOR,32-BIT,BGA,516PIN,PLASTIC

KMPC8250ACVRIHBB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	BGA, BGA516,26X26,40
Reach Compliance Code	unknown
bit size	32
JESD-30 code	S-PBGA-B516
JESD-609 code	e0
Number of terminals	516
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA516,26X26,40
Package shape	SQUARE
Package form	GRID ARRAY
power supply	1.7/2.1,3.3 V
Certification status	Not Qualified
speed	300 MHz
surface mount	YES
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

KMPC8250ACVRIHBB Related Products

	KMPC8250ACVRIHBB	KXPC8250AZUPHBA	KMPC8250AZUPIBB	KXPC8250ACZUMHBA	KMPC8250ACZUMHBB	KMPC8250AVRIHBB
Description	IC,MICROPROCESSOR,32-BIT,BGA,516PIN,PLASTIC	IC,MICROPROCESSOR,32-BIT,BGA,480PIN,PLASTIC	IC,MICROPROCESSOR,32-BIT,BGA,480PIN,PLASTIC	IC,MICROPROCESSOR,32-BIT,BGA,480PIN,PLASTIC	IC,MICROPROCESSOR,32-BIT,BGA,480PIN,PLASTIC	IC,MICROPROCESSOR,32-BIT,BGA,516PIN,PLASTIC
package instruction	BGA, BGA516,26X26,40	BGA, BGA480,29X29,50	BGA, BGA480,29X29,50	BGA, BGA480,29X29,50	BGA, BGA480,29X29,50	BGA, BGA516,26X26,40
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknow
JESD-30 code	S-PBGA-B516	S-PBGA-B480	S-PBGA-B480	S-PBGA-B480	S-PBGA-B480	S-PBGA-B516
Number of terminals	516	480	480	480	480	516
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA516,26X26,40	BGA480,29X29,50	BGA480,29X29,50	BGA480,29X29,50	BGA480,29X29,50	BGA516,26X26,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
power supply	1.7/2.1,3.3 V	1.7/2.1,3.3 V	1.7/2.2 V	1.7/2.1,3.3 V	1.7/2.1,3.3 V	1.7/2.1,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	YES	YES	YES	YES	YES
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Is it Rohs certified?	incompatible	incompatible	-	incompatible	incompatible	incompatible
Maker	NXP	NXP	-	NXP	NXP	NXP
bit size	32	32	-	32	32	32
JESD-609 code	e0	e0	-	e0	e0	e0
speed	300 MHz	300 MHz	-	300 MHz	300 MHz	300 MHz
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	-	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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