IC,MICROPROCESSOR,32-BIT,BGA,480PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | BGA, BGA480,29X29,50 |
| Reach Compliance Code | unknown |
| bit size | 32 |
| JESD-30 code | S-PBGA-B480 |
| JESD-609 code | e0 |
| Number of terminals | 480 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Encapsulate equivalent code | BGA480,29X29,50 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| power supply | 1.7/2.1,3.3 V |
| Certification status | Not Qualified |
| speed | 300 MHz |
| surface mount | YES |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal pitch | 1.27 mm |
| Terminal location | BOTTOM |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
| KMPC8250ACZUMHBB | KXPC8250AZUPHBA | KMPC8250AZUPIBB | KXPC8250ACZUMHBA | KMPC8250ACVRIHBB | KMPC8250AVRIHBB | |
|---|---|---|---|---|---|---|
| Description | IC,MICROPROCESSOR,32-BIT,BGA,480PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,BGA,480PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,BGA,480PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,BGA,480PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,BGA,516PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,BGA,516PIN,PLASTIC |
| package instruction | BGA, BGA480,29X29,50 | BGA, BGA480,29X29,50 | BGA, BGA480,29X29,50 | BGA, BGA480,29X29,50 | BGA, BGA516,26X26,40 | BGA, BGA516,26X26,40 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| JESD-30 code | S-PBGA-B480 | S-PBGA-B480 | S-PBGA-B480 | S-PBGA-B480 | S-PBGA-B516 | S-PBGA-B516 |
| Number of terminals | 480 | 480 | 480 | 480 | 516 | 516 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | BGA | BGA | BGA | BGA | BGA | BGA |
| Encapsulate equivalent code | BGA480,29X29,50 | BGA480,29X29,50 | BGA480,29X29,50 | BGA480,29X29,50 | BGA516,26X26,40 | BGA516,26X26,40 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| power supply | 1.7/2.1,3.3 V | 1.7/2.1,3.3 V | 1.7/2.2 V | 1.7/2.1,3.3 V | 1.7/2.1,3.3 V | 1.7/2.1,3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | YES | YES | YES | YES |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | BALL | BALL | BALL | BALL | BALL | BALL |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1 mm | 1 mm |
| Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible | incompatible | incompatible |
| Maker | NXP | NXP | - | NXP | NXP | NXP |
| bit size | 32 | 32 | - | 32 | 32 | 32 |
| JESD-609 code | e0 | e0 | - | e0 | e0 | e0 |
| speed | 300 MHz | 300 MHz | - | 300 MHz | 300 MHz | 300 MHz |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | - | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
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