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ADSP-21362KSWZ-1AA

Description
IC 16-BIT, 55.55 MHz, OTHER DSP, PBGA136, MO-205AE, BGA-136, Digital Signal Processor
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,56 Pages
ManufacturerADI
Websitehttps://www.analog.com
Environmental Compliance  
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ADSP-21362KSWZ-1AA Overview

IC 16-BIT, 55.55 MHz, OTHER DSP, PBGA136, MO-205AE, BGA-136, Digital Signal Processor

ADSP-21362KSWZ-1AA Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerADI
Parts packaging codeBGA
package instructionMO-205AE, BGA-136
Contacts136
Reach Compliance Codecompliant
ECCN code3A991.A.2
Other featuresALSO REQUIRES 3.3V SUPPLY
Address bus width16
barrel shifterYES
boundary scanYES
maximum clock frequency55.55 MHz
External data bus width16
FormatFLOATING POINT
Internal bus architectureMULTIPLE
JESD-30 codeS-PBGA-B136
JESD-609 codee3
length12 mm
low power modeNO
Number of terminals136
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.7 mm
Maximum supply voltage1.26 V
Minimum supply voltage1.14 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width12 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, OTHER

ADSP-21362KSWZ-1AA Related Products

ADSP-21362KSWZ-1AA ADSP-21365WYSWZ-2C ADSP-21365WBSWZ-1A ADSP-21365WYSWZ-2A ADSP-21362WYSWZ-2A ADSP-21362WBSWZ-1A ADSP-21364WBSWZ-1A ADSP-21364WYSWZ-2A ADSP-21366WBSWZ-1A ADSP-21366WYSWZ-2A
Description IC 16-BIT, 55.55 MHz, OTHER DSP, PBGA136, MO-205AE, BGA-136, Digital Signal Processor IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor
Parts packaging code BGA QFP QFP QFP QFP QFP QFP QFP QFP QFP
package instruction MO-205AE, BGA-136 MS-026BFB-HD, LQFP-144 MS-026BFB-HD, LQFP-144 MS-026BFB-HD, LQFP-144 MS-026BFB-HD, LQFP-144 MS-026BFB-HD, LQFP-144 MS-026BFB-HD, LQFP-144 MS-026BFB-HD, LQFP-144 MS-026BFB-HD, LQFP-144 MS-026BFB-HD, LQFP-144
Contacts 136 144 144 144 144 144 144 144 144 144
Reach Compliance Code compliant unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A991.A.2 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
Other features ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address bus width 16 16 16 16 16 16 16 16 16 16
barrel shifter YES YES YES YES YES YES YES YES YES YES
boundary scan YES YES YES YES YES YES YES YES YES YES
maximum clock frequency 55.55 MHz 55.55 MHz 55.55 MHz 55.55 MHz 55.55 MHz 55.55 MHz 55.55 MHz 55.55 MHz 55.55 MHz 55.55 MHz
External data bus width 16 16 16 16 16 16 16 16 16 16
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
Internal bus architecture MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE
JESD-30 code S-PBGA-B136 S-PQFP-G144 S-PQFP-G144 S-PQFP-G144 S-PQFP-G144 S-PQFP-G144 S-PQFP-G144 S-PQFP-G144 S-PQFP-G144 S-PQFP-G144
JESD-609 code e3 e3 e3 e3 e3 e3 e3 e3 e3 e3
length 12 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
low power mode NO NO NO NO NO NO NO NO NO NO
Number of terminals 136 144 144 144 144 144 144 144 144 144
Maximum operating temperature 70 °C 105 °C 85 °C 105 °C 105 °C 85 °C 85 °C 105 °C 85 °C 105 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA HLFQFP HLFQFP HLFQFP HLFQFP HLFQFP HLFQFP HLFQFP HLFQFP HLFQFP
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.7 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage 1.26 V 1.26 V 1.26 V 1.26 V 1.26 V 1.26 V 1.26 V 1.26 V 1.26 V 1.26 V
Minimum supply voltage 1.14 V 1.14 V 1.14 V 1.14 V 1.14 V 1.14 V 1.14 V 1.14 V 1.14 V 1.14 V
Nominal supply voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) TIN TIN TIN TIN TIN TIN TIN TIN TIN
Terminal form BALL GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.8 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location BOTTOM QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
width 12 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
uPs/uCs/peripheral integrated circuit type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
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