ADSP-21365WYSWZ-2C datasheet, PDF

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ADSP-21365WYSWZ-2C: DescriptionIC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，56 Pages; ManufacturerADI; Websitehttps://www.analog.com

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ADSP-21365WYSWZ-2C Overview

IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor

ADSP-21365WYSWZ-2C Parametric

Parameter Name	Attribute value
Parts packaging code	QFP
package instruction	MS-026BFB-HD, LQFP-144
Contacts	144
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width	16
barrel shifter	YES
boundary scan	YES
maximum clock frequency	55.55 MHz
External data bus width	16
Format	FLOATING POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-PQFP-G144
JESD-609 code	e3
length	20 mm
low power mode	NO
Number of terminals	144
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HLFQFP
Package shape	SQUARE
Package form	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum supply voltage	1.26 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
width	20 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

ADSP-21365WYSWZ-2C Related Products

	ADSP-21365WYSWZ-2C	ADSP-21365WBSWZ-1A	ADSP-21365WYSWZ-2A	ADSP-21362KSWZ-1AA	ADSP-21362WYSWZ-2A	ADSP-21362WBSWZ-1A	ADSP-21364WBSWZ-1A	ADSP-21364WYSWZ-2A	ADSP-21366WBSWZ-1A	ADSP-21366WYSWZ-2A
Description	IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor	IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor	IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor	IC 16-BIT, 55.55 MHz, OTHER DSP, PBGA136, MO-205AE, BGA-136, Digital Signal Processor	IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor	IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor	IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor	IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor	IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor	IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, MS-026BFB-HD, LQFP-144, Digital Signal Processor
Parts packaging code	QFP	QFP	QFP	BGA	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	MS-026BFB-HD, LQFP-144	MS-026BFB-HD, LQFP-144	MS-026BFB-HD, LQFP-144	MO-205AE, BGA-136	MS-026BFB-HD, LQFP-144	MS-026BFB-HD, LQFP-144	MS-026BFB-HD, LQFP-144	MS-026BFB-HD, LQFP-144	MS-026BFB-HD, LQFP-144	MS-026BFB-HD, LQFP-144
Contacts	144	144	144	136	144	144	144	144	144	144
Reach Compliance Code	unknown	unknown	unknown	compliant	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A991.A.2	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Other features	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY
Address bus width	16	16	16	16	16	16	16	16	16	16
barrel shifter	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
boundary scan	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	55.55 MHz	55.55 MHz	55.55 MHz	55.55 MHz	55.55 MHz	55.55 MHz	55.55 MHz	55.55 MHz	55.55 MHz	55.55 MHz
External data bus width	16	16	16	16	16	16	16	16	16	16
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Internal bus architecture	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PBGA-B136	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144
JESD-609 code	e3	e3	e3	e3	e3	e3	e3	e3	e3	e3
length	20 mm	20 mm	20 mm	12 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm
low power mode	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
Number of terminals	144	144	144	136	144	144	144	144	144	144
Maximum operating temperature	105 °C	85 °C	105 °C	70 °C	105 °C	85 °C	85 °C	105 °C	85 °C	105 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HLFQFP	HLFQFP	HLFQFP	LFBGA	HLFQFP	HLFQFP	HLFQFP	HLFQFP	HLFQFP	HLFQFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.7 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum supply voltage	1.26 V	1.26 V	1.26 V	1.26 V	1.26 V	1.26 V	1.26 V	1.26 V	1.26 V	1.26 V
Minimum supply voltage	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V
Nominal supply voltage	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN	TIN	TIN	Matte Tin (Sn)	TIN	TIN	TIN	TIN	TIN	TIN
Terminal form	GULL WING	GULL WING	GULL WING	BALL	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.8 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	BOTTOM	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
width	20 mm	20 mm	20 mm	12 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER

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