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BR93L76RFVT-WE1 |
BR93L76RFV-WE1 |
BR93L76RFVJ-WE1 |
Description |
EEPROM Card, 512X16, Serial, CMOS, PDSO8 |
EEPROM Card, 512X16, Serial, CMOS, PDSO8, |
EEPROM Card, 512X16, Serial, CMOS, PDSO8 |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
Maker |
ROHM Semiconductor |
ROHM Semiconductor |
ROHM Semiconductor |
package instruction |
TSSOP, TSSOP8,.25 |
TSSOP, TSSOP8,.25 |
TSSOP, TSSOP8,.19 |
Reach Compliance Code |
compliant |
compliant |
compliant |
Data retention time - minimum |
40 |
40 |
40 |
Durability |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
JESD-30 code |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609 code |
e3 |
e2 |
e3 |
memory density |
8192 bit |
8192 bit |
8192 bit |
Memory IC Type |
EEPROM CARD |
EEPROM CARD |
EEPROM CARD |
memory width |
16 |
16 |
16 |
Number of terminals |
8 |
8 |
8 |
word count |
512 words |
512 words |
512 words |
character code |
512 |
512 |
512 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
organize |
512X16 |
512X16 |
512X16 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
TSSOP |
TSSOP |
Encapsulate equivalent code |
TSSOP8,.25 |
TSSOP8,.25 |
TSSOP8,.19 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial |
SERIAL |
SERIAL |
SERIAL |
Peak Reflow Temperature (Celsius) |
225 |
NOT SPECIFIED |
225 |
power supply |
2/5 V |
2/5 V |
2/5 V |
Programming voltage |
2.7 V |
2.7 V |
2.7 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Serial bus type |
MICROWIRE |
MICROWIRE |
MICROWIRE |
Maximum standby current |
0.000002 A |
0.000002 A |
0.000002 A |
Maximum slew rate |
0.0045 mA |
0.0045 mA |
0.0045 mA |
surface mount |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
MATTE TIN |
Tin/Copper (Sn/Cu) |
MATTE TIN |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.635 mm |
0.635 mm |
0.635 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
write protect |
SOFTWARE |
SOFTWARE |
SOFTWARE |
Humidity sensitivity level |
1 |
- |
1 |