OTP ROM, 1KX8, TTL, CQCC28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | QCCN, LCC28,.45SQ |
| Reach Compliance Code | unknown |
| JESD-30 code | S-XQCC-N28 |
| JESD-609 code | e0 |
| memory density | 8192 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of terminals | 28 |
| word count | 1024 words |
| character code | 1000 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 1KX8 |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC28,.45SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| 82HS189A/B3C | N82HS189AN | N82HS189AA | 82HS189A/BLA | N82HS189AN-B | N82HS189N-B | |
|---|---|---|---|---|---|---|
| Description | OTP ROM, 1KX8, TTL, CQCC28 | OTP ROM, 1KX8, TTL, PDIP24 | OTP ROM, 1KX8, TTL, PQCC28 | OTP ROM, 1KX8, TTL, CDIP24 | OTP ROM, 1KX8, TTL, PDIP24 | OTP ROM, 1KX8, TTL, PDIP24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | S-XQCC-N28 | R-PDIP-T24 | S-PQCC-J28 | R-XDIP-T24 | R-PDIP-T24 | R-PDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 28 | 24 | 28 | 24 | 24 | 24 |
| word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C |
| organize | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCN | DIP | QCCJ | DIP | DIP | DIP |
| Encapsulate equivalent code | LCC28,.45SQ | DIP24,.3 | LDCC28,.5SQ | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| Maximum slew rate | - | 0.175 mA | 0.175 mA | - | 0.175 mA | 0.175 mA |
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