DAC01N datasheet, PDF - EEWORLD Datasheet

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DAC01N: DescriptionIC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, UUC14, 0.093 X 0.055 INCH, DIE-14, Digital to Analog Converter; CategoryAnalog mixed-signal IC converter; File Size148KB，4 Pages; ManufacturerADI; Websitehttps://www.analog.com

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DAC01N Overview

IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, UUC14, 0.093 X 0.055 INCH, DIE-14, Digital to Analog Converter

DAC01N Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ADI
Parts packaging code	DIE
package instruction	0.093 X 0.055 INCH, DIE-14
Contacts	14
Reach Compliance Code	compliant
Maximum analog output voltage	11.89 V
Minimum analog output voltage	-11.89 V
Converter type	D/A CONVERTER
Enter bit code	BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY
Input format	PARALLEL, WORD
JESD-30 code	R-XUUC-N14
JESD-609 code	e0
Nominal negative supply voltage	-15 V
Number of digits	6
Number of functions	1
Number of terminals	14
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Nominal settling time (tstl)	1.5 µs
Nominal supply voltage	15 V
surface mount	YES
technology	BIPOLAR
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED

DAC01N Related Products

	DAC01N	DAC01FY	DAC01G	DAC01CY	DAC01HY	DAC01Y
Description	IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, UUC14, 0.093 X 0.055 INCH, DIE-14, Digital to Analog Converter	IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter	IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, UUC14, 0.093 X 0.055 INCH, DIE-14, Digital to Analog Converter	IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter	IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter	IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIE	DIP	DIE	DIP	DIP	DIP
package instruction	0.093 X 0.055 INCH, DIE-14	HERMETIC SEALED, CERAMIC, DIP-14	0.093 X 0.055 INCH, DIE-14	HERMETIC SEALED, CERAMIC, DIP-14	HERMETIC SEALED, CERAMIC, DIP-14	HERMETIC SEALED, CERAMIC, DIP-14
Contacts	14	14	14	14	14	14
Reach Compliance Code	compliant	not_compliant	compliant	unknown	unknown	compliant
Maximum analog output voltage	11.89 V	11.89 V	11.89 V	11.89 V	11.89 V	11.89 V
Minimum analog output voltage	-11.89 V	-11.89 V	-11.89 V	-11.89 V	-11.89 V	-11.89 V
Converter type	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER
Enter bit code	BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY	BINARY, 2'S COMPLEMENT BINARY, 1'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY	BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY	BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY	BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY	BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY
Input format	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD
JESD-30 code	R-XUUC-N14	R-GDIP-T14	R-XUUC-N14	R-GDIP-T14	R-GDIP-T14	R-GDIP-T14
JESD-609 code	e0	e0	e0	e0	e0	e0
Nominal negative supply voltage	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V
Number of digits	6	6	6	6	6	6
Number of functions	1	1	1	1	1	1
Number of terminals	14	14	14	14	14	14
Package body material	UNSPECIFIED	CERAMIC, GLASS-SEALED	UNSPECIFIED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIE	DIP	DIE	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	IN-LINE	UNCASED CHIP	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal settling time (tstl)	1.5 µs	1.5 µs	1.5 µs	1.5 µs	1.5 µs	1.5 µs
Nominal supply voltage	15 V	15 V	15 V	15 V	15 V	15 V
surface mount	YES	NO	YES	NO	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Terminal surface	TIN LEAD	Tin/Lead (Sn/Pb)	TIN LEAD	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	TIN LEAD
Terminal form	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	UPPER	DUAL	UPPER	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maker	ADI	-	ADI	ADI	ADI	ADI
length	-	19.43 mm	-	19.43 mm	19.43 mm	19.43 mm
Maximum linear error (EL)	-	0.391%	-	0.391%	0.391%	0.391%
Maximum operating temperature	-	125 °C	-	70 °C	70 °C	125 °C
Maximum seat height	-	5.08 mm	-	5.08 mm	5.08 mm	5.08 mm
Maximum stabilization time	-	3 µs	-	3 µs	3 µs	3 µs
Maximum slew rate	-	9.3 mA	-	9.3 mA	9.3 mA	9.3 mA
Temperature level	-	MILITARY	-	COMMERCIAL	COMMERCIAL	MILITARY
Terminal pitch	-	2.54 mm	-	2.54 mm	2.54 mm	2.54 mm
width	-	7.62 mm	-	7.62 mm	7.62 mm	7.62 mm

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