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DAC01Y

Description
IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter
CategoryAnalog mixed-signal IC    converter   
File Size148KB,4 Pages
ManufacturerADI
Websitehttps://www.analog.com
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DAC01Y Overview

IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter

DAC01Y Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerADI
Parts packaging codeDIP
package instructionHERMETIC SEALED, CERAMIC, DIP-14
Contacts14
Reach Compliance Codecompliant
Maximum analog output voltage11.89 V
Minimum analog output voltage-11.89 V
Converter typeD/A CONVERTER
Enter bit codeBINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY
Input formatPARALLEL, WORD
JESD-30 codeR-GDIP-T14
JESD-609 codee0
length19.43 mm
Maximum linear error (EL)0.391%
Nominal negative supply voltage-15 V
Number of digits6
Number of functions1
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum stabilization time3 µs
Nominal settling time (tstl)1.5 µs
Maximum slew rate9.3 mA
Nominal supply voltage15 V
surface mountNO
technologyBIPOLAR
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

DAC01Y Related Products

DAC01Y DAC01FY DAC01G DAC01CY DAC01N DAC01HY
Description IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, UUC14, 0.093 X 0.055 INCH, DIE-14, Digital to Analog Converter IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, UUC14, 0.093 X 0.055 INCH, DIE-14, Digital to Analog Converter IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP DIP DIE DIP DIE DIP
package instruction HERMETIC SEALED, CERAMIC, DIP-14 HERMETIC SEALED, CERAMIC, DIP-14 0.093 X 0.055 INCH, DIE-14 HERMETIC SEALED, CERAMIC, DIP-14 0.093 X 0.055 INCH, DIE-14 HERMETIC SEALED, CERAMIC, DIP-14
Contacts 14 14 14 14 14 14
Reach Compliance Code compliant not_compliant compliant unknown compliant unknown
Maximum analog output voltage 11.89 V 11.89 V 11.89 V 11.89 V 11.89 V 11.89 V
Minimum analog output voltage -11.89 V -11.89 V -11.89 V -11.89 V -11.89 V -11.89 V
Converter type D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER
Enter bit code BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, 2'S COMPLEMENT BINARY, 1'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY
Input format PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD
JESD-30 code R-GDIP-T14 R-GDIP-T14 R-XUUC-N14 R-GDIP-T14 R-XUUC-N14 R-GDIP-T14
JESD-609 code e0 e0 e0 e0 e0 e0
Nominal negative supply voltage -15 V -15 V -15 V -15 V -15 V -15 V
Number of digits 6 6 6 6 6 6
Number of functions 1 1 1 1 1 1
Number of terminals 14 14 14 14 14 14
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED UNSPECIFIED CERAMIC, GLASS-SEALED UNSPECIFIED CERAMIC, GLASS-SEALED
encapsulated code DIP DIP DIE DIP DIE DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE UNCASED CHIP IN-LINE UNCASED CHIP IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal settling time (tstl) 1.5 µs 1.5 µs 1.5 µs 1.5 µs 1.5 µs 1.5 µs
Nominal supply voltage 15 V 15 V 15 V 15 V 15 V 15 V
surface mount NO NO YES NO YES NO
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Terminal surface TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE
Terminal location DUAL DUAL UPPER DUAL UPPER DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Maker ADI - ADI ADI ADI ADI
length 19.43 mm 19.43 mm - 19.43 mm - 19.43 mm
Maximum linear error (EL) 0.391% 0.391% - 0.391% - 0.391%
Maximum operating temperature 125 °C 125 °C - 70 °C - 70 °C
Maximum seat height 5.08 mm 5.08 mm - 5.08 mm - 5.08 mm
Maximum stabilization time 3 µs 3 µs - 3 µs - 3 µs
Maximum slew rate 9.3 mA 9.3 mA - 9.3 mA - 9.3 mA
Temperature level MILITARY MILITARY - COMMERCIAL - COMMERCIAL
Terminal pitch 2.54 mm 2.54 mm - 2.54 mm - 2.54 mm
width 7.62 mm 7.62 mm - 7.62 mm - 7.62 mm

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