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DAC01FY

Description
IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter
CategoryAnalog mixed-signal IC    converter   
File Size148KB,4 Pages
ManufacturerADI
Websitehttps://www.analog.com
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DAC01FY Overview

IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter

DAC01FY Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeDIP
package instructionHERMETIC SEALED, CERAMIC, DIP-14
Contacts14
Reach Compliance Codenot_compliant
Maximum analog output voltage11.89 V
Minimum analog output voltage-11.89 V
Converter typeD/A CONVERTER
Enter bit codeBINARY, 2'S COMPLEMENT BINARY, 1'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY
Input formatPARALLEL, WORD
JESD-30 codeR-GDIP-T14
JESD-609 codee0
length19.43 mm
Maximum linear error (EL)0.391%
Nominal negative supply voltage-15 V
Number of digits6
Number of functions1
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply+-15 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum stabilization time3 µs
Nominal settling time (tstl)1.5 µs
Maximum slew rate9.3 mA
Nominal supply voltage15 V
surface mountNO
technologyBIPOLAR
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
Base Number Matches1

DAC01FY Related Products

DAC01FY DAC01G DAC01CY DAC01N DAC01HY DAC01Y
Description IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, UUC14, 0.093 X 0.055 INCH, DIE-14, Digital to Analog Converter IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, UUC14, 0.093 X 0.055 INCH, DIE-14, Digital to Analog Converter IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP DIE DIP DIE DIP DIP
package instruction HERMETIC SEALED, CERAMIC, DIP-14 0.093 X 0.055 INCH, DIE-14 HERMETIC SEALED, CERAMIC, DIP-14 0.093 X 0.055 INCH, DIE-14 HERMETIC SEALED, CERAMIC, DIP-14 HERMETIC SEALED, CERAMIC, DIP-14
Contacts 14 14 14 14 14 14
Reach Compliance Code not_compliant compliant unknown compliant unknown compliant
Maximum analog output voltage 11.89 V 11.89 V 11.89 V 11.89 V 11.89 V 11.89 V
Minimum analog output voltage -11.89 V -11.89 V -11.89 V -11.89 V -11.89 V -11.89 V
Converter type D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER
Enter bit code BINARY, 2'S COMPLEMENT BINARY, 1'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY
Input format PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD
JESD-30 code R-GDIP-T14 R-XUUC-N14 R-GDIP-T14 R-XUUC-N14 R-GDIP-T14 R-GDIP-T14
JESD-609 code e0 e0 e0 e0 e0 e0
Nominal negative supply voltage -15 V -15 V -15 V -15 V -15 V -15 V
Number of digits 6 6 6 6 6 6
Number of functions 1 1 1 1 1 1
Number of terminals 14 14 14 14 14 14
Package body material CERAMIC, GLASS-SEALED UNSPECIFIED CERAMIC, GLASS-SEALED UNSPECIFIED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code DIP DIE DIP DIE DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE UNCASED CHIP IN-LINE UNCASED CHIP IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal settling time (tstl) 1.5 µs 1.5 µs 1.5 µs 1.5 µs 1.5 µs 1.5 µs
Nominal supply voltage 15 V 15 V 15 V 15 V 15 V 15 V
surface mount NO YES NO YES NO NO
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Terminal surface Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD
Terminal form THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE
Terminal location DUAL UPPER DUAL UPPER DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
length 19.43 mm - 19.43 mm - 19.43 mm 19.43 mm
Maximum linear error (EL) 0.391% - 0.391% - 0.391% 0.391%
Maximum operating temperature 125 °C - 70 °C - 70 °C 125 °C
Maximum seat height 5.08 mm - 5.08 mm - 5.08 mm 5.08 mm
Maximum stabilization time 3 µs - 3 µs - 3 µs 3 µs
Maximum slew rate 9.3 mA - 9.3 mA - 9.3 mA 9.3 mA
Temperature level MILITARY - COMMERCIAL - COMMERCIAL MILITARY
Terminal pitch 2.54 mm - 2.54 mm - 2.54 mm 2.54 mm
width 7.62 mm - 7.62 mm - 7.62 mm 7.62 mm
Maker - ADI ADI ADI ADI ADI
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