IC DRAM CONTROLLER, PQFP132, PLASTIC, QFP-132, Memory Controller
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
package instruction | BQFP, SPQFP132,1.1SQ |
Reach Compliance Code | unknown |
Address bus width | 32 |
boundary scan | NO |
External data bus width | |
JESD-30 code | S-PQFP-G132 |
JESD-609 code | e0 |
length | 24.13 mm |
low power mode | NO |
Number of blocks | 4 |
Number of terminals | 132 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | BQFP |
Encapsulate equivalent code | SPQFP132,1.1SQ |
Package shape | SQUARE |
Package form | FLATPACK, BUMPER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 4.45 mm |
Maximum slew rate | 100 mA |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.64 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 24.13 mm |
uPs/uCs/peripheral integrated circuit type | MEMORY CONTROLLER, DRAM |
NSBMC292VF-16 | NSBMC292VF-25 | NSBMC292VF-33 | |
---|---|---|---|
Description | IC DRAM CONTROLLER, PQFP132, PLASTIC, QFP-132, Memory Controller | IC DRAM CONTROLLER, PQFP132, PLASTIC, QFP-132, Memory Controller | IC DRAM CONTROLLER, PQFP132, PLASTIC, QFP-132, Memory Controller |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Maker | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
package instruction | BQFP, SPQFP132,1.1SQ | BQFP, SPQFP132,1.1SQ | BQFP, SPQFP132,1.1SQ |
Reach Compliance Code | unknown | unknown | unknown |
Address bus width | 32 | 32 | 32 |
boundary scan | NO | NO | NO |
JESD-30 code | S-PQFP-G132 | S-PQFP-G132 | S-PQFP-G132 |
JESD-609 code | e0 | e0 | e0 |
length | 24.13 mm | 24.13 mm | 24.13 mm |
low power mode | NO | NO | NO |
Number of blocks | 4 | 4 | 4 |
Number of terminals | 132 | 132 | 132 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BQFP | BQFP | BQFP |
Encapsulate equivalent code | SPQFP132,1.1SQ | SPQFP132,1.1SQ | SPQFP132,1.1SQ |
Package shape | SQUARE | SQUARE | SQUARE |
Package form | FLATPACK, BUMPER | FLATPACK, BUMPER | FLATPACK, BUMPER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 4.45 mm | 4.45 mm | 4.45 mm |
Maximum slew rate | 100 mA | 100 mA | 100 mA |
Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.64 mm | 0.64 mm | 0.64 mm |
Terminal location | QUAD | QUAD | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 24.13 mm | 24.13 mm | 24.13 mm |
uPs/uCs/peripheral integrated circuit type | MEMORY CONTROLLER, DRAM | MEMORY CONTROLLER, DRAM | MEMORY CONTROLLER, DRAM |